Compound eye image sensor design
A flexible image sensor having an array of lenses disposed on one surface of a substrate flexible optical polymeric substrate, and an array of organic integrated circuit photodetectors on a second surface of the substrate, each lens in the lens array being in optical correspondence with a photodetector in the second array. The lens array and the photodetector array are manufactured using similar, low-temperature methods, preferably utilizing the same toolset.
1. An image sensor comprising:
a flexible substrate having a first side facing a first direction and a second side facing a second direction opposite to the first direction,
a plurality of lenses in a first array disposed on the first surface of the flexible substrate, and
a plurality of organic integrated circuit photodetectors in a second array on the second side of the substrate, wherein each lens in the first array is aligned with a photodetector in the second array.
2. The image sensor of claim 1 , wherein the first array of lenses is formed by etching the substrate, such that the substrate and the lenses are made of the same material.
3. The image sensor of claim 1 , wherein the substrate is a UV-curable polymer.
4. The image sensor of claim 1 , wherein the first array of lenses is deposited by a continuous roll process.
5. The image sensor of claim 1 , wherein the first array and the second array are aligned to an accuracy of at least three microns.
6. The image sensor of claim 1 , wherein a first tool set is used to place the first array onto the substrate and a second tool set is used to place the second array on the substrate.
7. The image sensor of claim 6 , wherein the first tool set and second tool set are the same.
8. The image sensor of claim 1 , wherein the second array is deposited on the second side of the substrate by a wafer level organic integrated circuit technology.
9. The image sensor of claim 1 , wherein the second array is placed on the substrate by a process that operates at a temperature of less than about 120 degrees centigrade.
10. The image sensor of claim 1 , wherein the second array is placed on the substrate by a solution printing technique.
11. The image sensor of claim 1 , wherein the substrate is planar.
12. The image sensor of claim 1 , wherein the substrate is curved.
13. The image sensor of claim 12 , wherein at least one of the lens pitch and lens focal length is customized to a geometry of the substrate.
14. The image sensor of claim 1 , wherein the substrate surface is ellipsoidal.
15. The image sensor of claim 1 , wherein at least one of a lens pitch and a lens focal length varies within the first lens array.
16. The image sensor of claim 1 , wherein the first array and the second array are one-dimensional arrays.
17. The image sensor of claim 1 , wherein the first array and the second array are two-dimensional arrays.
18. The image sensor of claim 1 further comprising at least one intermediate array of lenses disposed between the first array of lenses and the second array of photodetectors.
19. The image sensor of claim 18 , wherein each lens in each of the at least one intermediate array of lenses has an optical correspondence with a lens in the first array of lenses.
20. The image sensor of claim 18 , wherein each lens of the at least one intermediate arrays has an optical correspondence with a photodetector in the second array.
21. A method of fabricating an image sensor comprising:
depositing an array of photodetectors on a first surface of a flexible substrate, the first surface facing a first direction, the photodetectors being deposited using wafer level organic integrated circuit technology; and
forming an array of lenses on a second surface of the substrate, the second surface facing a second direction opposite to the first direction.
22. The method of claim 21 , wherein the lens array is deposited using a continuous roll type manufacturing process.
23. The method of claim 21 , wherein the photodetectors are deposited using a solution printing process.