Apparatus for chemical mechanical polishing
View Patent ↗Apparatus for chemical mechanical polishing are disclosed. A disclosed apparatus includes a polishing station having a polishing pad, a gas supplier to generate pressurized gas to press a wafer toward the polishing pad, and a polishing head assembly including a planar member having a plurality of fine holes in communication with the gas supplier and a membrane to press the wafer toward the polishing pad due to the pressurized gas received through the plurality of fine holes, wherein the plurality of fine holes are arranged to rotate at different radii of rotation when the planar member rotates.
1. An apparatus for chemical mechanical polishing, comprising:
a polishing station provided with a polishing pad;
a gas supplier to generate pressurized gas for pressing a wafer against the polishing pad; and
a polishing head assembly including a planar member having a plurality of holes connected to the gas supplier through a fluid line and a membrane to press the wafer against the polishing pad under the influence of the pressurized gas received through the plurality of holes,
wherein the plurality of holes are arranged such that they rotate at different radii of rotation when the planar member rotates.
2. An apparatus as defined in claim 1 , wherein the plurality of holes are arranged in a vane-shaped pattern.
3. An apparatus as defined in claim 1 wherein the plurality of holes are arranged in a spiral line pattern.
4. An apparatus as defined in claim 1 , wherein the plurality of holes are arranged in an irregular pattern.
5. An apparatus as defined in claim 1 , wherein at least some of the holes have a circular shape.
6. An apparatus as defined in claim 1 , wherein at least some of the holes have a polygonal shape.
7. An apparatus as defined in claim 2 , wherein at least some of the holes have a circular shape.
8. An apparatus as defined in claim 2 , wherein at least some of the holes have a polygonal shape.
9. An apparatus as defined in claim 4 , wherein at least some of the holes have a circular shape.
10. An apparatus as defined in claim 4 , wherein at least some of the holes have a polygonal shape.
11. An apparatus as defined in claim 1 , wherein the holes have a plurality of sizes.
12. An apparatus as defined in claim 2 , wherein the holes have a plurality of sizes.
13. An apparatus as defined in claim 4 , wherein the holes have a plurality of sizes.
14. An apparatus as defined in claim 1 , wherein diameters of the holes increase from a center of the planar member to an exterior circumference of the planar member.
15. An apparatus as defined in claim 2 , wherein diameters of the holes increase from a center of the planar member to an exterior circumference of the planar member.
16. An apparatus as defined in claim 1 , wherein:
the plurality of holes are arranged in a (1) vane-shaped pattern or (2) a spiral line pattern proceeding outward from a center of the planar member;
the holes have a circular shape or a polygonal shape; and
the diameters of the holes near an exterior circumference of the planar member are larger than the diameters of the holes near the center of the planar member.
17. A polishing head for holding a wafer to be polished in a chemical mechanical polishing apparatus, the polishing head having a planar member comprising:
a body defining a plurality of holes, the plurality of holes being located such that they do not form concentric circles about a central axis of the body.
18. An apparatus as defined in claim 17 , wherein the plurality of holes are located to rotate at different radii of rotation when the planar member rotates.
19. A polishing head as defined in claim 17 , wherein
the plurality of holes are arranged in a (1) vane-shaped pattern or (2) a spiral line pattern; and
the holes have a circular shape or a polygonal shape.
20. A polishing head as defined in claim 17 , wherein the diameters of the holes near an exterior circumference of the body are larger than the diameters of the holes near a center of the body.