Optoelectronic component having electrical connection and formation method thereof
View Patent ↗Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
1. An optoelectronic component, comprising:
a silicon substrate having a first surface and a second surface opposite the first surface;
an optoelectronic device flip-chip mounted on the first surface;
an electrical conductor extending from the first surface to the second surface; and
a trench in the substrate, wherein the optoelectronic device is disposed in the trench.
2. The optoelectronic component of claim 1 , wherein the electrical conductor extends through at least one hole which extends through the substrate.
3. The optoelectronic component of claim 2 , wherein the hole is filled with solder.
4. The optoelectronic component of claim 2 , wherein the hole is tapered in cross-section.
5. The optoelectronic component of claim 1 , wherein the electrical conductor extends over a side edge surface of the substrate.
6. The optoelectronic component of claim 1 , wherein the optoelectronic device is a light emitting diode.
7. The optoelectronic component of claim 1 , further comprising a heat sink to conduct heat away from the optoelectronic device.
8. The optoelectronic component of claim 1 , further comprising an encapsulant over the optoelectronic device.
9. The optoelectronic component of claim 8 , further comprising an optical element in the encapsulant.
10. The optoelectronic component of claim 1 , further comprising a driver in the substrate.
11. The optoelectronic component of claim 1 , comprising a plurality of optoelectronic devices on the substrate.
12. A wafer-level optoelectronic assembly, comprising a plurality of the optoelectronic components of claim 1 in wafer-level form.
13. An optoelectronic component, comprising:
a substrate having a first surface and a second surface opposite the first surface;
an optoelectronic device flip-chip mounted on the first surface; and
an electrical conductor extending from the first surface to the second surface.
14. The optoelectronic component of claim 13 , wherein the electrical conductor extends through at least one hole which extends through the substrate.
15. The optoelectronic component of claim 13 , wherein the electrical conductor extends over a side edge surface of the chip.
16. The optoelectronic component of claim 13 , further comprising a heat sink to conduct heat away from the optoelectronic device.
17. A wafer-level optoelectronic assembly, comprising a plurality of the optoelectronic components of claim 13 in wafer-level form.
18. A method of forming the optoelectronic component of claim 1 , comprising:
(a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface;
(b) forming an electrical conductor extending from the first surface to the second surface; and
(c) flip-chip mounting an optoelectronic device on the first surface, wherein the optoelectronic device is disposed in a trench in the substrate.
19. A method of forming the optoelectronic component of claim 13 , comprising:
(a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface;
(b) forming an electrical conductor extending from the first surface to the second surface; and
(c) flip-chip mounting an optoelectronic device on the first surface.
20. An optoelectronic component, comprising:
a silicon substrate having a first surface and a second surface opposite the first surface;
an optoelectronic device flip-chip mounted on the first surface;
an electrical conductor extending from the first surface to the second surface; and
a driver in the substrate.