Patent Assignment
Reel/Frame 026323/0651
Assignment of Assignor's Interest
Recorded: 2011-05-23
Received: 2011-05-23
Pages: 6
Assignor
IP CUBE PARTNERS CO. LTD.
Executed: 2011-05-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KRX, KOREA, REPUBLIC OF
Covered Properties
(55)
Optoelectronic Component Comprising an Encapsulant
Application:
12/079,248 →
Micro-Optical Device
Application:
11/545,908 →
Optoelectronic Component
Application:
11/506,250 →
Alignment Apparatus and Method for Aligning Stacked Devices
Application:
11/500,061 →
Optical Device Package Having Optical Feedthrough
Application:
11/446,819 →
Optical Assembly
Application:
11/445,043 →
Wafer-Level Optoelectonic Device Substrate
Application:
11/223,403 →
Optoelectronic Component with Front to Side Surface Electrical Conductor
Application:
11/223,402 →
Optoelectronic Component Having Electrical Connection and Formation Method Thereof
Application:
11/220,884 →
Etching Process for Micromachining Materials and Devices Fabricated Thereby
Application:
11/152,671 →
Optoelectronic Component Having Passively Aligned Optoelectronic Device
Application:
11/139,270 →
Optoelectronic Component with Encapsulant
Application:
11/124,775 →
Glass Bonded Fiber Array and Method for the Fabrication Thereof
Application:
10/488,569 →
Optical Device Package
Application:
11/080,002 →
Method of Metallizing Non-Conductive Substrates and Metallized Non-Conductive Substrates Formed Thereby
Application:
11/023,763 →
Optical Waveguide Termination with Vertical and Horizontal Mode Shaping
Application:
10/498,182 →
Optical Switch Assembly with Flex Plate and Method for Making
Application:
10/954,467 →
Solder Pads and Method of Making a Solder Pad
Application:
10/925,410 →
Method of Fabricating Optical Filters
Application:
10/871,689 →
External Cavity Semi-Conductor Laser and Method for Fabrication Thereof
Application:
10/860,810 →
Etching Process for Micromachining Crystalline Materials and Devices Fabricated Thereby
Application:
10/860,809 →
Optical Fiber Right Angle Transition
Application:
10/494,869 →
Optical Fiber Array with Variable Fiber Angle Alignment and Method for the Fabrication Thereof
Application:
10/492,281 →
Optical Waveguide Termination with Vertical and Horizontal Mode Shaping
Application:
10/450,475 →
Optical Waveguide Switch
Application:
10/356,663 →
Silicon Optical Microbench Devices and Waffer-Level Testing Thereof
Application:
10/214,433 →
Etching Process for Micromachining Crystalline Materials and Devices Fabricated Thereby
Application:
10/199,476 →
Solder Pads and Method of Making a Solder Pad
Application:
10/126,491 →
Optical Fiber Attached to a Substrate
Application:
10/126,938 →
Micromachined Structures Made by Combined Wet and Dry Etching
Application:
10/076,858 →
Combined Wet and Dry Etching Process for Micromachining of Crystalline Materials
Application:
10/071,261 →
Optoelectronic Submount Having an on-Edge Optoelectronic Device
Application:
10/066,299 →
Optical Switch Assembly with Flex Plate and Method for Making
Application:
10/022,726 →
Optical Device Package for Flip-Chip Mounting
Application:
10/013,084 →
Optical Device Package Having a Configured Frame
Application:
09/990,509 →
Optical Bench with Alignment Subassembly
Application:
09/988,055 →
Optical Assembly for Coupling with Integrated Optical Devices and Method for Making
Application:
09/987,766 →
Optical Connector System
Application:
10/054,575 →
Single Mask Process for Patterning Microchip Having Grayscale and Micromachined Features
Application:
09/999,332 →
Variable Width Waveguide for Mode-Matching and Method for Making
Application:
09/983,984 →
Fiber Array with V-Groove Chip and Mount
Application:
10/037,971 →
Wafer Level Packaging for Optoelectronic Devices
Application:
09/999,517 →
Optical Device Package
Application:
09/966,973 →
Alignment Apparatus and Method for Aligning Stacked Devices
Application:
09/923,842 →
Method of Making a 3-D Structure Using an Erodable Mask Formed from a Film Having a Composition That Varies in Its Direction of Thickness
Application:
09/911,834 →
Method for Making Integrated Optical Waveguides and Micromachined Features
Application:
09/862,593 →
Method of Fabricating Optical Filters
Application:
09/862,037 →
Multi-Level Optical Structure and Method of Manufacture
Application:
09/858,999 →
Optical Waveguide Switch
Application:
09/845,773 →
Single Mask Technique for Making Positive and Negative Micromachined Features on a Substrate
Application:
09/847,798 →
Optical Interconnects
Application:
09/835,863 →
Optical Waveguide Switch
Application:
09/835,106 →
Methods and Devices for Coupling Optoelectronic Packages
Application:
09/827,183 →
Optoelectronic Packages Having Insulation Layers
Application:
09/824,205 →
Micromachined, Etalon-Based Optical Fiber Pressure Sensor
Application:
09/814,526 →