Optoelectronic component
View Patent ↗Provided are optoelectronic components which include an optoelectronic device mounted on a silicon substrate and a flexible circuit electrically connected to the optoelectronic device.
1. An optoelectronic component, comprising:
a silicon substrate;
an optoelectronic device mounted on the silicon substrate;
an encapsulant over the optoelectronic component; and
a flexible circuit attached to the silicon substrate and electrically connected to the optoelectronic device.
2. The optoelectronic component of claim 1 , wherein the silicon substrate has a trench in a first surface thereof and the optoelectronic device is disposed in the trench.
3. The optoelectronic component of claim 1 , wherein the flexible circuit is attached to the silicon substrate along an edge of the substrate.
4. The optoelectronic component of claim 1 , wherein the silicon substrate has a via hole therethrough.
5. The optoelectronic component of claim 1 , comprising a plurality of the optoelectronic devices.
6. An optoelectronic component, comprising:
a silicon substrate having a micromachined feature;
an optoelectronic device mounted on the silicon substrate; and
a flexible circuit attached to the silicon substrate and electrically connected to the optoelectronic device.
7. The optoelectronic component of claim 6 , wherein the micromachined feature is a via hole through the silicon substrate.
8. The optoelectronic component of claim 7 , wherein the silicon substrate has a trench in a first surface thereof and the optoelectronic device is disposed in the trench.
9. The optoelectronic component of claim 7 , wherein the flexible circuit is attached to the silicon substrate along an edge of the substrate.
10. The optoelectronic component of claim 6 , wherein the micromachined feature is a trench formed in a first surface of the silicon substrate, and the optoelectronic device is disposed in the trench.
11. The optoelectronic component of claim 10 , wherein the flexible circuit is attached to the silicon substrate along an edge of the substrate.
12. The optoelectronic component of claim 6 , comprising a plurality of the optoelectronic devices.
13. An optoelectronic component, comprising:
a silicon substrate;
a plurality of optoelectronic devices mounted on the silicon substrate; and
a flexible circuit attached to the silicon substrate and electrically connected to the optoelectronic devices.
14. The optoelectronic component of claim 13 , wherein the silicon substrate has a trench in a first surface thereof and the optoelectronic devices are disposed in the trench.
15. The optoelectronic component of claim 13 , wherein the flexible circuit is attached to the silicon substrate along an edge of the substrate.
16. The optoelectronic component of claim 13 , wherein the silicon substrate has a via hole therethrough.