Optoelectronic component comprising an encapsulant
View Patent ↗Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
1. An optoelectronic component, comprising:
a substrate;
an optoelectronic device on the substrate; and
an encapsulant over the optoelectronic device and discontinuous over the substrate,
wherein the encapsulant has a molded face which comprises an optical element formed from the encapsulant.
2. The optoelectronic component of claim 1 , comprising a plurality of the optoelectronic devices and a plurality of the optical elements.
3. The optoelectronic component of claim 2 , wherein the optical elements are lenses.
4. The optoelectronic component of claim 1 , wherein the optical element is a lens.
5. The optoelectronic component of claim 4 , wherein the lens comprises a rounded protrusion.
6. The optoelectronic component of claim 1 , wherein the optical element is a mirror for reflecting light to or from the optoelectronic device.
7. The optoelectronic component of claim 6 , wherein the mirror comprises an angular surface of the encapsulant off which light reflects.
8. The optoelectronic component of claim 1 , wherein the substrate comprises a trench in which the optoelectronic device is disposed.
9. The optoelectronic component of claim 1 , wherein the substrate is formed from silicon.
10. The optoelectronic component of claim 1 , wherein the encapsulant is discontinuous over at least a portion of the substrate opposite the substrate over which the optoelectronic device is on.