IP Library Granted Patent US 7,068,870
Granted Patent B2
US 7,068,870 · App. 09/983,984 · Granted Jun 27, 2006

Variable width waveguide for mode-matching and method for making

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Quick Facts
Patent No.
US 7,068,870
App. No.
09/983,984
Granted
Jun 27, 2006
Kind
B2
Abstract

A variable width waveguide useful for mode matching between dissimilar optical waveguides and optical fibers and a method for making the same is described. In one embodiment, a tapered waveguide is etched in a substrate, a cladding material is laid over the upper surface of the substrate and within the waveguide, and the waveguide is then filled with a core material. The core material may be deposited in a single step, or in successive deposition steps.

Claims (70)

1. An optical waveguide, comprising:

a substrate comprising an upper surface and a trench therein, wherein said trench has a varying profile along at least a part of its length;

a core material in said trench; and

a cladding material in said trench between said substrate and said core material,

wherein said core material and said cladding material have a varying profile along said at least said part of the length of said trench.

2. The optical waveguide of claim 1 , wherein said trench has a profile which tapers from a large end to a small end.

3. The optical waveguide of claim 2 , wherein said trench tapers in thickness.

4. The optical waveguide of claim 2 , wherein said trench tapers from a large width to a small width.

5. The optical waveguide of claim 2 , wherein said core material at said small end has a greater index of refraction at said upper surface than said core material at said large end.

6. The optical waveguide of claim 1 , wherein said trench comprises an input waveguide channel and a plurality of output waveguide channels.

7. The optical waveguide of claim 1 , wherein said trench has a stepped profile.

8. The optical waveguide of claim 1 , wherein said trench has a profile with periodic variations in width.

9. The optical waveguide of claim 1 , wherein the refractive index of said core material decreases in a thickness direction away from said cladding material.

10. The optical waveguide of claim 1 , wherein said substrate comprises silicon.

11. The optical waveguide of claim 10 , wherein said cladding material comprises silicon dioxide.

12. The optical waveguide of claim 1 , wherein said core material comprises silicon oxynitride.

13. The optical waveguide of claim 1 , wherein said core material comprises doped glass.

14. The optical waveguide of claim 1 , wherein said substrate comprises glass.

15. The optical waveguide of claim 14 , wherein said core material comprises successively deposited material on said cladding material, wherein each successively deposited material has a lower index of refraction than the preceding deposited material.

16. A method for forming an optical waveguide of claim 1 , said method comprising:

forming a trench in a substrate comprising an upper surface, wherein the trench has a varying profile along at least a part of its length;

locating a cladding material in the trench;

depositing a core material on the cladding material in the trench; and

planarizing the substrate to the upper surface.

17. The method of claim 16 , wherein said forming comprises:

gray-scale patterning of a photoresist;

transferring the patterning of the photoresist to the substrate surface; and

etching the patterning of the photoresist.

18. The method of claim 16 , wherein said forming comprises isotropic etching.

19. The method of claim 16 , wherein the substrate comprises silicon, said locating comprising oxidizing the cladding material.

20. The method of claim 19 , wherein said oxidizing comprises a thermal oxidation process.

21. The method of claim 16 , wherein said locating comprises covering said upper surface and said trench with a chemical vapor deposition oxide.

22. The method of claim 16 , wherein said locating comprises covering said upper surface and said trench with an oxynitride.

23. The method of claim 16 , wherein said locating comprises covering said upper surface and said trench with a doped oxide.

24. The method of claim 16 , wherein said depositing comprises successive depositions of the core material on the cladding material, wherein each successive deposited core material has a lower index of refraction than the preceding deposited core material.

25. The method of claim 16 , wherein said planarizing comprises chemical-mechanical planarizing.

26. The optical waveguide of claim 1 , wherein the trench is formed by etching away a portion of the substrate.

27. The optical waveguide of claim 1 , wherein the core material and the cladding material are coplanar with the substrate upper surface.

28. An integrated optic chip, comprising:

a substrate comprising an upper surface;

a waveguide comprising:

a trench in said substrate, said trench comprising a varying profile along at least a part of its length;

a core material in said trench; and

a cladding material in said trench between said substrate and said core material;

wherein said core material and said cladding material have a varying profile along said at least said part of the length of said trench; and

integrated optical circuits optically coupled to said waveguide.

29. The integrated optic chip of claim 28 , wherein said trench has a profile which tapers from a large end to a small end.

30. The integrated optic chip of claim 29 , wherein said trench tapers in thickness.

31. The integrated optic chip of claim 29 , wherein said trench tapers from a large width to a small width.

32. The integrated optic chip of claim 29 , wherein said core material at said small end has a greater index of refraction at said upper surface than said core material at said large end.

33. The integrated optic chip of claim 28 , wherein the refractive index of said core material decreases in a thickness direction away from said cladding material.

34. The integrated optic chip of claim 28 , wherein the trench is formed by etching away a portion of the substrate.

35. The integrated optic chip of claim 28 , wherein the core material and the cladding material are coplanar with the substrate upper surface.

36. An optical waveguide, comprising:

a substrate comprising an upper surface and a trench therein, wherein said trench has a varying profile along at least a part of its length;

a core material in said trench; and

a cladding material in said trench between said substrate and said core material,

wherein said trench tapers from a large widtyh to a small width, and wherein said core material at said small end has a greater index of refraction at said upper surface than said core material at said large end.

37. An optical waveguide, comprising:

a substrate comprising an upper surface and a trench therein, wherein said trench has a varying profile along at least a part of its length;

a core material in said trench; and

a cladding material in said trench between said substrate and said core material,

wherein said core material and said cladding material fill said trench.

38. An integrated optic chip, comprising:

a substrate comprising an upper surface;

a waveguide comprising:

a trench in said substrate, said trench comprising a varying profile along at least a part of its length;

a core material in said trench; and

a cladding material in said trench between said substrate and said core material;

wherein said core material and said cladding material fill said trench; and integrated optical circuits optically coupled to said waveguide.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2011
From: IP CUBE PARTNERS CO. LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026323/0651 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2011
From: NUVOTRONICS, LLC
To: IP CUBE PARTNERS CO. LTD.
Reel/Frame 025950/0807 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2010
From: ROHM AND HAAS ELECTRONIC MATERIALS LLC
To: NUVOTRONICS, LLC
Reel/Frame 024571/0939 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2002
From: STEINBERG, DAN A.; HUGHES, WILLIAM T.; DAUTARTAS, MINDAUGAS F.; MEDER, MARTIN G.; STACY, WILLIAM T.; ZIZZI, MEREDITH ANN; RICKS, NEAL; FISHER, JOHN; WILLIAMS, RIPLEY F.; RASNAKE, LARRY JASEAN; LUO, HUI; SHERRER, DAVID W.; ZACHERL, GARY; LEBER, DON E.; HEIKS, NOEL A.
To: HALEOS, INC.
Reel/Frame 013174/0328 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2002
From: HALEOS, INC.
To: SHIPLEY COMPANY, L.L.C.
Reel/Frame 013181/0159 →