IP Library › Assignment 013174/0328
Patent Assignment
Reel/Frame 013174/0328

Assignment of Assignor's Interest

Recorded: 2002-10-15 Received: 2002-10-16 Pages: 25
Assignors
DAUTARTAS, MINDAUGAS F.
Executed: 2002-09-10
FISHER, JOHN
Executed: 2002-09-10
HEIKS, NOEL A.
Executed: 2002-09-10
HUGHES, WILLIAM T.
Executed: 2002-09-10
MEDER, MARTIN G.
Executed: 2002-09-10
RASNAKE, LARRY JASEAN
Executed: 2002-09-10
RICKS, NEAL
Executed: 2002-09-10
STACY, WILLIAM T.
Executed: 2002-09-10
WILLIAMS, RIPLEY F.
Executed: 2002-09-10
ZIZZI, MEREDITH ANN
Executed: 2002-09-10
LUO, HUI
Executed: 2002-09-12
STEINBERG, DAN A.
Executed: 2002-09-12
SHERRER, DAVID W.
Executed: 2002-09-13
ZACHERL, GARY
Executed: 2002-09-17
LEBER, DON E.
Executed: 2002-09-20
Assignee
HALEOS, INC.
3150 STATE STREET, BLACKSBURG, VA, 24060, UNITED STATES
Covered Properties (66)
Silicon Optical Microbench Devices and Waffer-Level Testing Thereof
Application: 10/214,433 →
Etching Process for Micromachining Crystalline Materials and Devices Fabricated Thereby
Fiber Array with Passive Alignment
Application: 10/194,954 →
Venting Optical Microbench
Application: 10/135,192 →
Solder Pads and Method of Making a Solder Pad
Application: 10/126,491 →
Optical Fiber Attached to a Substrate
Application: 10/126,938 →
Wet and dry etching process on <110> silicon and resulting structures
Application: 10/124,612 →
Tapered Optical Fiber for Coupling to Diffused Optical Waveguides
Application: 10/113,817 →
Method for Making Optical Devices with a Moving Mask and Optical Devices Made Thereby
Application: 10/081,995 →
Methods and Apparatus for Detecting Electromagnetic Interference
Application: 10/076,568 →
Method and Device for Passively Locating a Fiber Stub in a Groove
Application: 10/071,871 →
Combined Wet and Dry Etching Process for Micromachining of Crystalline Materials
Application: 10/071,261 →
Optoelectronic Submount Having an on-Edge Optoelectronic Device
Application: 10/066,299 →
Method for the detection of organic pollutants using syndiotactic polystyrene polymers as sensing elements
Application: 10/022,725 →
Optical Device Package for Flip-Chip Mounting
Application: 10/013,084 →
Tapered waveguide for coupling between channel waveguide and rib waveguide
Application: 60/336,933 →
Optical Device Package Having a Configured Frame
Application: 09/990,509 →
Fixed-Length Delay Generation Circuit
Application: 10/015,211 →
Optical Bench with Alignment Subassembly
Application: 09/988,055 →
Optical Assembly for Coupling with Integrated Optical Devices and Method for Making
Application: 09/987,766 →
Submount Having Transmission Line and Method for Forming
Application: 09/987,139 →
Optical Connector System
Application: 10/054,575 →
Right angle fiber optic connector
Application: 60/337,007 →
Topsheet Made of Nonwoven Fabric Used in Disposable Wearing Article
Application: 10/013,984 →
Single Mask Process for Patterning Microchip Having Grayscale and Micromachined Features
Application: 09/999,332 →
Variable Width Waveguide for Mode-Matching and Method for Making
Application: 09/983,984 →
Fiber Array with V-Groove Chip and Mount
Application: 10/037,971 →
Wafer Level Packaging for Optoelectronic Devices
Application: 09/999,517 →
Optical fiber with collimated output having low back-reflection
Application: 10/041,517 →
Embedded waveguide with alignment grooves and method for making same
Application: 09/978,804 →
Optical Device Package
Application: 09/966,973 →
2-D fiber optic array with cross-fibers for alignment
Application: 60/325,043 →
Fiber Array with Support Post
Application: 09/957,755 →
Fiber array having fibers bonded to substrate with solder glass
Application: 60/318,189 →
Alignment Apparatus and Method for Aligning Stacked Devices
Application: 09/923,842 →
Wafer-level testing of silicon optical bench devices
Application: 60/310,378 →
Method of Making a 3-D Structure Using an Erodable Mask Formed from a Film Having a Composition That Varies in Its Direction of Thickness
Application: 09/911,834 →
V-groove with fiducial for a fiber stop
Application: 60/306,568 →
2XN fiber array with passive alignment
Application: 60/304,927 →
Fiber Optic Chip with Lenslet Array and Method of Fabrication
Application: 09/903,077 →
Method for molding a shaped optical fiber tip
Application: 09/681,969 →
Two-dimentional fiber array and method of manufacture
Application: 09/884,428 →
Method of fabricating an optical fiber array using photosensitive material
Application: 09/884,873 →
Method for Cleaving Integrated Optic Waveguides to Provide a Smooth Waveguide Endface
Application: 09/878,486 →
Optical fiber ferrule made from dry etched parts
Application: 09/878,810 →
Sustained-release analgesic compounds
Application: 60/295,556 →
Method for Making Integrated Optical Waveguides and Micromachined Features
Application: 09/862,593 →
Optical Waveguide Devices and Methods of Fabricating the Same
Application: 09/860,825 →
Method of Fabricating Optical Filters
Application: 09/862,037 →
Optical Switch Assembly and Method for Making
Application: 09/852,709 →
Optical Waveguide Ferrule and Method of Making an Optical Waveguide Ferrule
Application: 09/851,376 →
Multi-level lithography masks
Application: 09/853,250 →
Optical Waveguide Switch
Application: 09/845,773 →
Single Mask Technique for Making Positive and Negative Micromachined Features on a Substrate
Application: 09/847,798 →
Optical Interconnects
Application: 09/835,863 →
Semiconductor device and process for its manufacture to increase threshold voltage stability
Application: 60/283,803 →
Optical Waveguide Switch
Application: 09/835,106 →
Fiber Optic Array Switch
Application: 09/833,282 →
Optical Switch and Method for Making
Application: 09/828,842 →
Method for Preparing Melamine
Application: 09/828,999 →
Methods and Devices for Coupling Optoelectronic Packages
Application: 09/827,183 →
Single-piece alignment frame for optical fiber arrays
Application: 09/825,990 →
Two-dimensional array for rotational alignment of polarization maintaining optical fiber
Application: 09/824,638 →
Optoelectronic Packages Having Insulation Layers
Application: 09/824,205 →
Micromachined, Etalon-Based Optical Fiber Pressure Sensor
Application: 09/814,526 →
Micromachining with both dry and wet etching
Application: 60/266,931 →