Optical device package having optical feedthrough
View Patent ↗An optical microbench configured to facilitate wafer-level testing of opto-electronic devices is provided. The optical microbench includes an optoelectronic device mounted to a wafer in which the optical microbench is provided. The optical microbench also includes a beam deflector provided in the wafer and disposed along the optical path of the optoelectronic device. The beam deflector is configured to deflect a portion of the optical path to lie along a direction oriented out of the plane of the wafer. The optical microbench further includes an optical feed-through disposed along the optical path between the optoelectronic device and the beam deflector. The optical feed-through is configured to conduct an optical signal between the beam deflector and the optoelectronic device. A method for testing optoelectronic devices at the wafer level is also provided.
1. An optical device package, comprising:
a substrate;
an optoelectronic device mounted to the substrate;
a lens mounted to the substrate; and
a lid mounted to the substrate, the lid enclosing the optoelectronic device and the lens, wherein the lid comprises a wall section forming an optical feedthrough along an optical path for an optical beam to pass between the optoelectronic device and an exterior of the optical device package, wherein the optical feedthrough does not include an optical fiber stub.
2. The optical device package of claim 1 , further comprising a beam deflector disposed along the optical path for deflecting the optical beam out of plane with respect to an upper surface of the substrate.
3. The optical device package of claim 2 , wherein the beam deflector comprises a wall formed in the substrate upper surface.
4. The optical device package of claim 1 , wherein the optoelectronic device comprises an optical source.
5. The optical device package of claim 1 , wherein the optoelectronic device comprises a photodetector.
6. The optical device package of claim 1 , wherein the substrate comprises single crystal silicon.
7. The optical device package of claim 6 , wherein the substrate is a single crystal silicon wafer comprising a plurality of the packages.
8. The optical device package of claim 1 , wherein the substrate is a polymer.
9. The optical device package of claim 1 , wherein the optoelectronic device is disposed at a selected surface of the substrate which is recessed with respect to an upper surface of the substrate.
10. The optical device package of claim 1 , wherein the lid includes a recessed region.
11. The optical device package of claim 1 , wherein the package is hermetically sealed.
12. The optical device package of claim 1 , wherein the lens is mounted in a cavity recessed into the substrate.
13. The optical device package of claim 1 , further comprising an antireflection coating on the wall section of the lid.
14. The optical device package of claim 1 , wherein the antireflection coating is silicon nitride.
15. The optical device package of claim 1 , further comprising a bonding agent for adhering the lid to the substrate, wherein the bonding agent is a solder glass or a solder metal.
16. The optical device package of claim 1 , wherein the bonding agent is a solder glass.
17. An optical device package, comprising:
a substrate;
a lid mounted to the substrate, the lid and substrate forming an enclosed volume;
an optoelectronic device in the enclosed volume; and
an optical feedthrough along an optical path for an optical beam to pass between the optoelectronic device and an exterior of the optical device package, wherein the optical feedthrough comprises an optical waveguide formed in the lid, wherein the optical feedthrough does not include an optical fiber stub.
18. The optical device package of claim 17 , wherein the substrate comprises single crystal silicon.
19. The optical device package of claim 17 , wherein the enclosed volume is hermetically sealed.
20. The optical device package of claim 17 , wherein the optoelectronic device is mounted to the substrate.
21. The optical device package of claim 17 , wherein the optical feedthrough is formed in the lid.