IP Library › Granted Patent US 7,362,201
Granted Patent B2
US 7,362,201 · App. 11/221,131 · Granted Apr 22, 2008

Inductance device and manufacturing method thereof

Assignee: Yonezawa Electric Wire Co., Ltd.
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Quick Facts
Patent No.
US 7,362,201
App. No.
11/221,131
Granted
Apr 22, 2008
Kind
B2
Abstract

An inductance device has a hollow center coil around which a conducting wire is wound so that a hollow portion is formed along a center axis line of the hollow center coil, a filler which is filled into the hollow portion of the hollow center coil, and includes magnetic powder or a compound including the magnetic powder, and an accommodation case which accommodates the hollow core coil and has a bottom, wherein the filler is filled into the accommodation case.

Claims (11)

1. An inductance device comprising:

a hollow center coil including a conducting wire which is wound so that a hollow portion is formed along a center axis line of the hollow center coil;

a filler which is filled into the hollow portion of the hollow center coil, and includes magnetic powder or a compound including the magnetic powder,

an accommodation case made from a magnetic iron nickel alloy material containing the hollow center coil, the accommodation case having a bottom and an opening opposite the bottom, and being filled with the filler, wherein the conducting wire of the hollow center coil is in direct contact with the filler;

a sealing material sealing the opening of the accommodation case; and

at least one tongue piece provided at the opening of the accommodation case and bent inward against the sealing material for retaining the sealing material at the accommodation case opening.

2. An inductance device according to claim 1 , wherein the filler has an auto-melting nature film at an outer periphery thereof, and the filler is melted together due to auto-melting of the auto-melting nature film.

3. An inductance device according to claim 1 , wherein the accommodation case has an opening portion, and the opening portion is sealed by a copper laminated plate.

4. An inductance device according to claim 1 , wherein the accommodation case has an opening portion, and the opening portion is sealed by potting material.

5. An inductance device according to claim 1 , wherein the accommodation case has an opening portion, and the opening portion is sealed by a metal plate.

6. An inductance device according to claim 1 , wherein the accommodation case has an opening portion, and the opening portion is sealed by an insulative substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2005
From: SAEGUSA, SEIICHIRO; NAKAYA, HITOKI; OCHI, TAKAYUKI
To: YONEZAWA ELECTRIC WIRE CO., LTD.
Reel/Frame 016963/0215 →
Continuity (1)
Related Publication 20070052510A1 · Mar 8, 2007