Stripline structure with multiple ground vias separated by no more than 100 mil
View Patent ↗A stripline structure. The stripline structure includes a stripline transmission line, a first ground plane, a first dielectric layer overlaying the first ground plane, a conductive trace overlaying the first dielectric layer, a second dielectric layer overlaying the conductive trace, a second ground plane overlaying the second dielectric layer, multiple first conductive vias, and multiple second conductive vias. Each first conductive via and each second conductive via electrically connects the first ground plane to the second ground plane. The multiple first conductive vias are located along a first line parallel to the conductive trace, and the multiple second conductive vias are located along a second line parallel to the conductive trace. The first line and the second line are located on opposite sides of the conductive trace.
1. A stripline structure, comprising:
a stripline transmission line, comprising:
a first ground plane,
a first dielectric layer overlaying the first ground plane,
a conductive trace overlaying the first dielectric layer,
a second dielectric layer overlaying the conductive trace, and
a second ground plane overlaying the second dielectric layer,
multiple first conductive vias, wherein each first conductive via electrically connects the first ground plane to the second ground plane, wherein the multiple first conductive vias are located along a first line parallel to the conductive trace, and wherein the multiple first conductive vias are separated from each other by no more than 100 mils; and
multiple second conductive vias, wherein each second conductive via electrically connects the first ground plane to the second ground plane, wherein the multiple second conductive vias are located along a second line parallel to the conductive trace, wherein the first line and the second line are located on opposite sides of the conductive trace, and wherein the multiple second conductive vias are separated from each other by no more than 100 mils.
2. The stripline structure as recited in claim 1 , wherein the stripline structure is constructed as a part of a circuit interconnect structure selected from the group consisting of printed circuit boards and hybrid circuit structures.
3. The stripline structure as recited in claim 1 , wherein the multiple first conductive vias and the multiple second conductive vias are selected from the group consisting of plated thru-holes and laser drilled vias.
4. The stripline structure as recited in claim 1 , wherein the multiple first conductive vias comprise at least three first conductive vias and the multiple second conductive vias comprise at least three second conductive vias.
5. The stripline structure as recited in claim 1 , wherein the multiple first conductive vias are separated from each other by no more than 60 mils and wherein the multiple second conductive vias are separated from each other by no more than 60 mils.
6. The stripline structure as recited in claim 1 , wherein a separation distance between each first conductive vias and the conductive trace for all first conductive vias is equal to a separation distance between each second conductive vias and the conductive trace for all second conductive vias.
7. The stripline structure as recited in claim 1 , wherein a separation distance between each first conductive via and any adjacent first conductive via is equal for all first conductive vias.
8. The stripline structure as recited in claim 1 , wherein a separation distance between each second conductive via and any adjacent second conductive via is equal for all second conductive vias.
9. The stripline structure as recited in claim 1 , wherein a separation distance between each first conductive vias and the conductive trace is equal for all first conductive vias.
10. The stripline structure as recited in claim 1 , wherein a separation distance between each second conductive via and the conductive trace is equal for all second conductive vias.
11. The stripline structure as recited in claim 1 wherein a separation distance between each first conductive via and any adjacent first conductive via for all first conductive vias is equal to a separation distance between each second conductive via and any adjacent second conductive via for all second conductive vias.