Ceramic electronic component and method for manufacturing the same
The present invention relates to a ceramic electronic component wherein via conductors that are embedded in through holes of dielectric layers formed from a sintered body of ceramic particles are made by firing a electrically conductive paste for via conductor that contains inorganic particles made of the same material as the ceramic particles that constitute the dielectric layer and having an average particle diameter smaller than that of the ceramic particles, and a method for manufacturing the same. According to the present invention, such a ceramic electronic component can be provided that the via conductors and the internal electrodes are electrically connected with each other satisfactorily without voids generated therein.
1. A method for manufacturing a ceramic electronic component comprising:
forming through holes in ceramic green sheets containing first ceramic particles;
filling the through holes with a paste containing second ceramic particles wherein the second ceramic particles are the same material as the first ceramic particles and an average particle diameter of the second ceramic particles is smaller than that of the first ceramic particles; and
firing the ceramic green sheets and the paste,
wherein a sintering initiation temperature T 1 at which the first ceramic particles start sintering with the second ceramic particles at a boundary of the ceramic green sheets and the paste, a sintering initiation temperature T 2 at which the first ceramic particles inside the ceramic green sheets start sintering with each other and a sintering initiation temperature T 3 at which the second ceramic particles inside the paste start sintering with each other are set so as to satisfy both relationships (1) and (2):
T 1 <T 2 (1)
T 1 <T 3 (2).
2. The method according to claim 1 , wherein the sintering initiation temperatures T 2 and T 3 are set so as to satisfy relationship (3):
T 2 ≦T 3 (3).
3. A method for manufacturing a ceramic electronic component comprising:
forming through holes in ceramic green sheets containing first ceramic particles;
filling the through holes with a paste containing second ceramic particles wherein the second ceramic particles are the same material as the first ceramic particles and an average particle diameter of the second ceramic particles is smaller than that of the first ceramic particles; and
firing the ceramic green sheets and the paste,
wherein the ceramic green sheets contain a first sintering aid and the paste contains a second sintering aid, and the firing step comprises the steps of:
sintering the first particles with the second particles at a boundary between the ceramic green sheets and the paste by using the first sintering aid and/or the second sintering aid;
sintering the first ceramic particles with each other in the ceramic green sheets using the first sintering aid after the sintering step of the first and second ceramic particles starts; and
sintering the second ceramic particles using the second sintering aid after the sintering step of the first and second ceramic particles starts.
4. The method according to claim 3 , wherein the first sintering aid is the same material as the second sintering aid and the content of the first sintering aid in the ceramic green sheet is more than the content of the second sintering aid in the paste.
5. A method for manufacturing a ceramic electronic component comprising a ceramic sintered body having an electric circuit therein, comprising:
preparing ceramic green sheets containing first ceramic particles and having through holes therein;
providing a paste containing second ceramic particles;
filling the through holes with the paste;
stacking the ceramic green sheets; and
sintering first ceramic particles with the second ceramic particles at the boundary between the ceramic green sheets and the paste followed by sintering the first ceramic particles inside the ceramic green sheets and sintering the second ceramic particles inside the paste.
6. The method according to claim 5 , wherein the second ceramic particles are the same material as the first ceramic particles and an average particle size of the second particles is smaller than that of the first ceramic particles.