IP Library › Granted Patent US 7,868,522
Granted Patent B2
US 7,868,522 · App. 11/223,386 · Granted Jan 11, 2011

Adjusted frequency temperature coefficient resonator

Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 7,868,522
App. No.
11/223,386
Granted
Jan 11, 2011
Kind
B2
Abstract

A temperature compensated pair of resonators. The temperature compensated pair of resonators comprises a first resonator configured to resonate at a first frequency and having a first frequency temperature coefficient and a second resonator configured to resonate at a second frequency and having a second frequency temperature coefficient. The second frequency is greater than the first frequency; the second frequency temperature coefficient is less than the first frequency temperature coefficient; and the first and the second resonators are fabricated on a common substrate.

Claims (16)

1. A temperature compensated pair of resonators, comprising:

a first resonator comprising: a first bottom electrode; a first piezoelectric structure comprising a first piezoelectric layer, a second piezoelectric layer and an interstitial layer disposed between, and in contact with both the first piezoelectric layer and the second piezoelectric layer, wherein the interstitial layer comprises a stiffness coefficient versus temperature that is greater than a stiffness coefficient versus temperature of either of the first piezoelectric layer or the second piezoelectric layer; a mass load layer disposed beneath the first bottom electrode; and a first top electrode, wherein the first resonator has a first resonant frequency; and

a second resonator comprising a second bottom electrode; a second piezoelectric structure; and a second top electrode, wherein the second resonator has a second resonant frequency and a temperature coefficient of the stiffness of the mass load layer differs from a temperature coefficient of stiffness of the second top electrode.

2. The temperature compensated pair of resonators as recited in claim 1 , wherein the mass load layer is an organic material.

3. The temperature compensated pair of resonators as recited in claim 2 , wherein the organic material is selected from the group consisting of PMMA (Polymethyl-methacrylate), PY (Polyimides), and BCB (Benzocyclobutene).

4. The temperature compensated pair of resonators as recited in claim 1 , wherein the mass load layer is a resin.

5. The temperature compensated pair of resonators as recited in claim 4 , wherein the resin is a low-k material.

6. The temperature compensated pair of resonators as recited in claim 1 , wherein the mass load layer is an oxide.

7. A temperature compensated pair of resonators, comprising:

a first resonator comprising: a first bottom electrode; a first piezoelectric structure comprising a first piezoelectric layer, a second piezoelectric layer and an interstitial layer disposed between, and in contact with both the first piezoelectric layer and the second piezoelectric layer, wherein the interstitial layer comprises a stiffness coefficient versus temperature that is greater than a stiffness coefficient verse temperature of either of the first piezoelectric layer or the second piezoelectric layer; a mass load layer disposed beneath the first bottom electrode; a first top electrode; and another mass load layer disposed over the first top electrode, wherein the first resonator has a first resonant frequency; and

a second resonator comprising: a second bottom electrode; a second piezoelectric structure; and a second top electrode, wherein the second resonator has a second resonant frequency and a temperature coefficient of the stiffness of the mass load layer disposed beneath the first bottom electrode differs from a temperature coefficient of stiffness of the second bottom electrode.

8. The temperature compensated pair of resonators as recited in claim 7 , wherein the mass load layer is an organic material.

9. The temperature compensated pair of resonators as recited in claim 8 , wherein the organic material is selected from the group consisting of PMMA (Polymethyl-methacrylate), PY (Polyimides), and BCB (Benzocyclobutene).

10. The temperature compensated pair of resonators as recited in claim 7 , wherein the mass load layer is a resin.

11. The temperature compensated pair of resonators as recited in claim 10 , wherein the resin is a low-k material.

12. The temperature compensated pair of resonators as recited in claim 7 , wherein the mass load layer is an oxide.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2006
From: RUBY, RICHARD C
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 017134/0241 →
Continuity (1)
Related Publication 20070063622A1 · Mar 22, 2007