IP Library Granted Patent US 7,323,413
Granted Patent B2
US 7,323,413 · App. 11/225,203 · Granted Jan 29, 2008

Method for stripping silicon nitride

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Quick Facts
Patent No.
US 7,323,413
App. No.
11/225,203
Granted
Jan 29, 2008
Kind
B2
Abstract

An apparatus and a method for stripping silicon nitride are disclosed that facilitate automatic, real-time, and exact measurement of etch rate and an ending time of the etching process when silicon nitride is stripped with phosphoric acid solution. The method for stripping silicon nitride includes the steps of: a) measuring initial concentration of a specific ion in a phosphoric acid solution contained in a reactor, b) dipping a silicon nitride-formed substrate into the phosphoric acid solution in the reactor, c) measuring instantaneous concentration of the specific ion in stripping solution extracted from the reactor when silicon nitride stripping is processed in the reactor, and d) finishing the silicon nitride stripping process if variation rate of the measured instantaneous concentration is not exceeding a predetermined standard, or returning to the step c) if the variation rate is more than the predetermined standard.

Claims (7)

1. A method for stripping silicon nitride comprising the steps of:

a) measuring initial concentration of a specific ion in a phosphoric acid solution contained in a reactor;

b) dipping a silicon nitride-formed substrate into the phosphoric acid solution in the reactor;

c) measuring instantaneous concentration of the specific ion in stripping solution extracted from the reactor when silicon nitride stripping is processed in the reactor; and

d) finishing the silicon nitride stripping process if variation rate of the measured instantaneous concentration is not exceeding a predetermined standard, or returning to the step c) if the variation rate is more than the predetermined standard, wherein the specific ion is SiO 3 2− or NH 4 + .

2. The method of claim 1 , wherein the instantaneous concentration of SiO 3 2− is obtained by measuring bonding energy between silicon and oxygen, and the instantaneous concentration of NH 4 + may be obtained by measuring bonding energy between nitrogen and hydrogen.

3. The method of claim 1 , wherein the predetermined standard to be compared with the variation rate of the measured instantaneous concentration is 0.

Assignments (2)
CHANGE OF NAME Recorded Jun 15, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018176/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2005
From: YIM, TERESA
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016993/0413 →