IP Library Granted Patent US 7,288,773
Granted Patent B2
US 7,288,773 · App. 11/233,488 · Granted Oct 30, 2007

Electron source, and charged-particle apparatus comprising such an electron source

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Quick Facts
Patent No.
US 7,288,773
App. No.
11/233,488
Granted
Oct 30, 2007
Kind
B2
Abstract

The invention provides an electron source suitable for use in a charged-particle apparatus, in which source a beam of electrons can be extracted from an electrode that is subjected to at least one of an electric potential, thermal excitation and photonic excitation, whereby at least part of the electrode comprises semiconductor material having a conduction band that is quantized into discrete energy levels. Such a source enjoys a relatively low energy spread, typically much smaller than that of a Cold Field Emission Gun (CFEG). The semiconductor material may, for example, comprise a semiconductor nanowire including InAs and GaInAs.

Claims (36)

1. An electron source suitable for use in a charged-particle apparatus, in which source a beam of electrons can be extracted from an electrode that is subjected to at least one of an electric potential, thermal excitation and photonic excitation, characterized in that at least part of the electrode comprises semiconductor material having a conduction band that is quantized into discrete energy levels.

2. An electron source according to claim 1 , wherein the energy levels are mutually separated by an interval of at least kT, where k is the Boltzmann constant and T is the absolute temperature of said material.

3. An electron source according to claim 1 characterized in that the electrode comprises at least one nanowire that is comprised of semiconductor material and that is attached to a macroscopic support.

4. An electron source according to claim 3 , wherein the nanowire forms an Ohmic contact with the support.

5. An electron source according to claim 3 , wherein said semiconductor material comprises a substance selected from the group consisting of InAs and GaInAs.

6. An electron source according to any of claim 3 , wherein said semiconductor material is N-doped.

7. An electron source according to claim 3 , wherein the electrode comprises a portion having a tapered extremity and said semiconductor material is provided at said extremity.

8. A particle-optical apparatus comprising an electron source, a holder for an object, and means for directing an electron beam from the electron source onto the object, characterized in that the electron source is a source according to claim 3 .

9. A particle-optical apparatus according to claim 8 , characterized in that the apparatus is selected from the group consisting of a scanning electron microscope, transmission electron microscope, transmission scanning electron microscope, scanning transmission electron microscope, and e-beam lithographic apparatus.

10. Method for manufacturing a device comprising the steps of:

providing a substrate being coated by a resist layer having a solubility which is alterable by electron bombardment,

bombarding the resist layer by electrons from an electron source,

developing the resist layer after the step of bombarding thereby exposing apart of the substrate while a remainder of the substrate remains being covered by a remainder of the resist layer, and subjecting the exposed parts of the substrate to a material removal treatment while the remainder of the resist layer serves as a mask characterized in that

the electron source is of a type as claimed in claim 3 .

11. An electron source according to claim 1 , wherein said semiconductor material comprises a substance selected from the group consisting of InAs and GaInAs.

12. An electron source according to any of claim 1 , wherein said semiconductor material is N-doped.

13. An electron source according to claim 1 , wherein the electrode comprises a portion having a tapered extremity and said semiconductor material is provided at said extremity.

14. A particle-optical apparatus comprising an electron source, a holder for an object and means for directing an electron beam from the electron source onto the object, characterized in that the electron source is a source according to claim 1 .

15. A particle-optical apparatus according to claim 14 , wherein, in addition to said electron beam, the apparatus comprises means for producing at least one other charged-particle beam.

16. A particle-optical apparatus according to claim 14 , characterized in tat the apparatus is selected from the group consisting of a scanning electron microscope, transmission electron microscope, transmission scanning electron microscope, scanning transmission electron microscope, and e-beam lithographic apparatus.

17. Method for manufacturing a device comprising the steps of:

providing a substrate being coated by a resist layer having a solubility which is alterable by electron bombardment,

bombarding the resist layer by electrons from an electron source,

developing the resist layer after the step of bombarding thereby exposing a part of the substrate while a remainder of the substrate remains being covered by a remainder of the resist layer, and subjecting the exposed parts of the substrate to a material removal treatment while the remainder of the resist layer serves as a mask characterized in that

the electron source is of a type as claimed in claim 1 .

18. An electron source suitable for use in a charged-particle apparatus, in which source a beam of electrons can be extracted from an electrode that is subjected to at least one of an electric potential, thermal excitation and photonic excitation, characterized in that said source comprises a semiconductor material capable of emitting an electron beam in which the energy spread is at most 0.2 eV at a temperature of 300 K.

19. An electron source according to claim 18 , wherein said semiconductor material comprises a substance selected from the group consisting of InAs and GaInAs.

20. An electron source according to any of claim 18 , wherein said semiconductor material is N-doped.

21. An electron source according to claim 18 , wherein the electrode comprises a portion having a tapered extremity and said semiconductor material is provided at said extremity.

22. A particle-optical apparatus comprising an electron source, a holder for an object, and means for directing an electron beam from the electron source onto the object, characterized in that the electron source is a source according to claim 18 .

23. A particle-optical apparatus according to claim 22 , characterized in that the apparatus is selected from the group consisting of a scanning electron microscope, transmission electron microscope, transmission scanning electron microscope, scanning transmission electron microscope, and e-beam lithographic apparatus.

24. Method for manufacturing a device comprising the steps of:

providing a substrate being coated by a resist layer having a solubility which is alterable by electron bombardment,

bombarding the resist layer by electrons from an electron source,

developing the resist layer after the step of bombarding thereby exposing a part of the substrate while a remainder of the substrate remains being covered by a remainder of the resist layer, and subjecting the exposed parts of the substrate to a material removal treatment while the a remainder of the resist layer serves as a mask characterized in that

the electron source is of a type as claimed in claim 18 .

Assignments (1)
RELEASE OF SECURITY INTEREST Recorded Apr 1, 2016
From: JPMORGAN CHASE BANK, N.A.; J.P. MORGAN EUROPE LIMITED
To: FEI COMPANY
Reel/Frame 038328/0787 →