Radio frequency identification transponder antenna
A RFID transponder having a microchip or integrated circuit, an impedance-matching structure and a resonant structure mounted on at least one substrate and connected to each other by an electric field.
1. A RFID transponder, comprising:
a microchip comprising a real component;
an impedance-matching structure of looped configuration electrically connected to the microchip;
a resonant structure connected to the microchip and impedance-matching structure by an electric field and positioned relative to the impedance-matching structure so as to match the termination impedance of the antenna to the real component of the microchip.
2. The transponder of claim 1 , further comprising a first substrate for mounting at least the impedance-matching component.
3. The transponder of claim 2 , wherein the microchip is mounted on the first substrate.
4. The transponder of claim 3 , wherein the resonant component is mounted on the first substrate.
5. The transponder of claim 2 , wherein the first substrate comprises first and second surfaces and wherein the impedance-matching structure is mounted on the first surface and the resonant structure is mounted on the second surface.
6. The transponder of claim 5 , wherein the first and second surfaces are disposed on opposite sides of the substrate.
7. The transponder of claim 2 , further comprising a second substrate for mounting the resonant structure.
8. The transponder of claim 2 , wherein the substrate is flexible.
9. The transponder of claim 8 , wherein the entire transducer is flexible.
10. The transponder of claim 8 , wherein the substrate consists of one of polymer film, paper, textile, rubber, leather and flexible polymer laminate.
11. The transponder of claim 1 , further comprising a substrate forming the resonant structure and wherein the impedance-matching structure is mounted on the substrate.
12. The transponder of claim 11 , wherein the impedance-matching structure is deposited on the substrate as one of a metallic stamped component, a stamped and bent component, and a wire.
13. The transponder of claim 11 , wherein the substrate is provided with a cavity and wherein the impedance-matching structure is provided in the cavity.
14. The transponder of claim 1 , wherein the resonant structure is structured as an element of an article to be marked and wherein the impedance-matching structure is arranged on the article.
15. The transponder of claim 1 , wherein at least one of the resonant structure and the impedance-matching structure are made of one of metal, electrically conductive polymer, electrically conductive dyes and electrically conductive particles.
16. The transponder of claim 1 , wherein the resonant structure is of a substantially M-shaped configuration.
17. The transponder of claim 1 , wherein the microchip is connected to the impedance-matching structure by one of flip chip mounting, wire, printed contacts and contacts fabricated by an additive process.