Resin molded semiconductor device and mold
View Patent ↗To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20 . A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.
1. A molding die comprising:
a first half mold having a first cavity and a second half mold having a second cavity, said first cavity including a block for forming a semiconductor chip accommodating space,
wherein said block is formed of a two-step structure comprising a wide portion which is in contact with a bottom of said first cavity and a narrow portion which is mounted on said wide portion,
wherein a pressing pin extends from a bottom of said second cavity and is configured to press a lead frame upon said wide portion of said block, and
wherein another pressing pin projects from said narrow portion toward said second cavity.
2. The molding die as defined in claim 1 , wherein said another pressing pin is variably extendable from the surface of said narrow portion.
3. The molding die as defined in claim 2 , wherein said another pressing pin is biased by a spring located in said block.
4. The molding die as defined in claim 1 , further comprising:
a hole disposed in said bottom of said first cavity.
5. The molding die as defined in claim 1 , further comprising:
a plurality of pressing pins extending from a bottom of said second cavity configured to press a lead frame upon said wide portion of said block.
6. The molding die as defined in claim 5 , further comprising:
a plurality of holes disposed in said bottom of said first cavity.
7. The molding die as defined in claim 1 , wherein said block is configured to form a channel-type land in a resin molded semiconductor device.
8. The molding die as defined in claim 1 , wherein said block is configured in a linear direction having an inverted T-shaped cross section.
9. A molding die comprising:
a first half mold having a first cavity including a land forming block for forming a linear channel in a resin molded semiconductor device; and
a second half mold having a second cavity including a pressing pin that extends from a bottom of said second cavity toward said first half mold,
wherein said land forming block comprises a tiered structure including a wide portion on a bottom of said first cavity and a narrow portion mounted on said wide portion,
wherein said pressing pin is configured to press a lead frame upon said wide portion of said land forming block, and
wherein another pressing pin projects from said narrow portion toward said second cavity.
10. The molding die as defined in claim 9 , wherein said another pressing pin is disposed to variably extend from the surface of said narrow portion.
11. The molding die as defined in claim 9 , wherein said another pressing pin is biased by a spring located in said land forming block.
12. The molding die as defined in claim 9 , further comprising:
a hole disposed in said bottom of said first cavity.
13. The molding die as defined in claim 9 , further comprising:
a plurality of pressing pins extending from a bottom of said second cavity configured to press a lead frame upon said wide portion of said block.
14. The molding die as defined in claim 13 , further comprising:
a plurality of holes disposed in said bottom of said first cavity.
15. The molding die as defined in claim 9 , wherein said land forming block is configured to form a channel-type land in a resin molded semiconductor device.
16. The molding die as defined in claim 9 , wherein said land forming block is configured in a linear direction having an inverted T-shaped cross section.
17. A molding die comprising:
a first half mold having a first cavity including a land forming block for forming a linear T-shaped channel in a resin molded semiconductor device; and
a second half mold having a second cavity including a pressing pin that extends from a bottom of said second cavity toward said first half mold,
wherein said pressing pin is configured to press a lead frame upon a wide portion of said land forming block, and
wherein another pressing pin projects from said land forming block toward said second cavity.
18. The molding die as defined in claim 17 , wherein said land forming block is formed of a two-step structure comprising said wide portion disposed a bottom of said first cavity and a narrow portion mounted on said wide portion.