System, method and a program for correcting conditions for controlling a charged particle beam for lithography and observation, and a program and method for manufacturing a semiconductor device

1. A system for correcting a charged particle beam lithography condition comprising:

an error calculation unit configured to calculate an error in an illumination position of a charged particle beam, the charged particle beam is controlled by a lithography condition corrected by initial correction parameters;

a temporary correction unit configured to calculate temporary correction parameters to decrease the error to a minimum; and

a main correction unit configured to calculate main correction parameters correcting the lithography condition, by executing statistical processing using the temporary correction parameters and the initial correction parameters.

2. The system of claim 1 , wherein the error calculation unit calculate the error between an actual illumination position of the charged particle beam and a target position of the charged particle beam.

3. The system of claim 1 , wherein the main correction unit calculates a weighted averages of the temporary correction parameters and the initial correction parameters, as the main correction parameters.

4. The system of claim 1 , further comprising a lithography tool configured to execute a drawing process using the main correction parameters.

5. The system of claim 1 , further comprising a prediction unit configured to predict the main correction parameters by time-sequentially analyzing the initial correction parameters.

6. The system of claim 5 , wherein the prediction unit takes into consideration an environmental parameter fluctuation amount generating a fluctuation in the illumination position of the charged particle beam.

7. The system of claim 6 , wherein the environmental parameter fluctuation amount is at least one of a fluctuation amount of a temperature of a sample chamber, a fluctuation amount of a pressure inside of a clean room, and a temperature inside of the clean room.

8. The system of claim 6 , wherein the prediction unit predicts the main correction parameters with a prediction equation, wherein the environmental parameter fluctuation amount is variable in the prediction equation.

9. The system of claim 8 , wherein the prediction unit corrects the prediction equation based on an error between the predicted main correction parameter and the calculated main correction parameter.

10. A system for correcting a charged particle beam observation condition comprising:

an error calculation unit configured to calculate an error in an illumination position of a charged particle beam observing a surface of a substrate, the charged particle beam is controlled by an observation condition corrected by initial correction parameters;

a temporary correction unit configured to calculate temporary correction parameters to decrease the error to a minimum; and

a main correction unit configured to calculate main correction parameters correcting the observation condition by executing statistical processing using the temporary correction parameters and the initial correction parameters.

11. A computer implemented method for correcting a charged particle beam lithography condition comprising:

calculating an error in an illumination position of a charged particle beam, the charged particle beam is controlled by a lithography condition corrected by initial correction parameters;

calculating temporary correction parameters to decrease the error to a minimum; and

calculating a main correction parameter for correcting the lithography condition, by executing statistical processing using the temporary correction parameters and the initial correction parameters.

12. The method of claim 11 , wherein calculating the error comprises:

calculating the error between an actual illumination position of the charged particle beam and the target position of the charged particle beam.

13. The method of claim 11 , wherein calculating the main correction parameter comprises:

calculating a weighted average of the temporary correction parameters and the initial correction parameters, as the main correction parameters.

14. The method of claim 11 , further comprising executing a drawing process by used of a corrected charged particle controlled by the main correction parameter.

15. The method of claim 11 , further comprising predicting the main correction parameters by time-sequentially analyzing the initial correction parameters.

16. The method of claim 15 , wherein predicting the main correction parameters comprises:

taking into consideration an environmental parameter fluctuation amount generating a fluctuation in the illumination position of the charged particle beam.

17. The method of claim 16 , wherein the environmental parameter fluctuation amount is at least one of a fluctuation amount of a temperature of a sample chamber, a fluctuation amount of a pressure inside of a clean room, and a temperature inside of the clean room.

18. The method of claim 17 , wherein predicting the main correction parameters comprises:

predicting the main correction parameters with a prediction equation, wherein the environmental parameter fluctuation amount is variable in the prediction equation; and

correcting the prediction equation based on an error between the predicted main correction parameters and the calculated main correction parameters.

19. A computer readable medium containing a computer program comprising instructions configured to be executed by a computer for executing an application of a system for correcting a charged particle beam lithography condition, the program comprising:

instructions for calculating an error in an illumination position of a charged particle beam, the charged particle beam is controlled by a lithography condition corrected by initial correction parameters;

instructions for calculating temporary correction parameters to decrease the error to a minimum; and

instructions for calculating main correction parameters correcting the lithography condition, by executing statistical processing using the temporary correction parameters and the initial correction parameters.

20. A method for manufacturing a semiconductor device comprising:

coating a resist film on a semiconductor wafer;

calculating an error in an illumination position of a charged particle beam, the charged particle beam is controlled by a lithography condition corrected by initial correction parameters, calculating temporary correction parameters to decrease the error to a minimum, calculating main correction parameters, by executing statistical processing using the temporary correction parameters and the initial correction parameters;

correcting the lithography condition using the main correction parameters; and

exposing the resist film by use of a corrected charged particle beam controlled by the corrected lithography condition.