Vacuum handler systems and processes for flexible automation of semiconductor fabrication
Apparatus and methods useful for flexible factory automation of semiconductor vacuum systems are presented, including a load lock accessible by robotic means located in a substrate handler connected to and positioned between the load lock and a vacuum process chamber. The substrate handler has a substrate storage position and a substrate active position, wherein the substrate handler is adapted to be isolated from the load lock when the load lock is pumped down, and a single vacuum pump is used to service both the load lock and the substrate handler.
1 . An apparatus for movement of substrates into and out of a processing chamber, the apparatus comprising:
a load lock for robotic introduction and removal of a semiconductor substrate;
a handler chamber fluidly connected to the load lock and positioned between the load lock and a processing chamber, the handler chamber including an active position and a storage position substantially vertically above the active position; and
a robot positioned within the handler chamber capable of accessing the load lock and the processing chamber and capable of vertical motion to move a substrate between the active position and the storage position.
2 . The apparatus of claim 1 , further including a vacuum pump connected to the load lock and the handler chamber, wherein the handler chamber is adapted to be isolated from the load lock when the load lock is pumped down by the vacuum pump.
3 . The apparatus of claim 1 , wherein the handler chamber includes a substrate holder at the storage position.
4 . The apparatus of claim 3 , wherein the substrate holder includes at least one horizontally moveable substrate holder element.
5 . The apparatus of claim 1 , wherein the apparatus is portable.
6 . The apparatus of claim 1 , further including multiple processing chambers.
7 . The apparatus of claim 1 , wherein the substrate is a semiconductor wafer.
8 . An apparatus for the treatment of substrates, said apparatus comprising:
a load lock adapted to receive a substrate;
a processing chamber for treating a substrate;
a substrate handler located between and connected to the load lock and the processing chamber, the substrate handler including an active position and a storage position, the storage position substantially vertically above said active position; and
a robot located within said substrate handler and capable of transferring a substrate in at least the following ways:
from the load lock to the storage position;
from the storage position to the processing chamber; and
from the processing chamber to the load lock.
9 . A method of processing substrates comprising the steps of:
placing a first substrate into a load lock, the load lock connected to a substrate handler;
evacuating the load lock and the substrate handler using a single vacuum pump;
moving the first substrate from the load lock to a storage position in the substrate handler using a robot that is internal to the substrate handler;
moving a second substrate from a process chamber to the load lock using the robot; and
moving the first substrate into the process chamber using the robot.
10 . The method of claim 9 , further comprising moving a substrate holder located at the storage position in order to accept the first substrate.
11 . The method of claim 10 , wherein the substrate holder comprises a pair of substrate holder elements, and the step of moving the substrate holder comprises moving the substrate holder elements horizontally.
12 . The method of claim 9 , further comprising retracting the robot into the substrate handler after the step of moving the first substrate into the process chamber.
13 . The method of claim 9 , further comprising isolating the load lock from the substrate holder after the step of moving the second substrate from the process chamber to the load lock; venting the load lock to atmospheric pressure; and
removing the second substrate from the load lock.
14 . The method of claim 13 , wherein the entire method is performed cyclically.
15 . A method of staging a first substrate for processing by a vacuum tool while a second substrate is being processed by the tool, the method comprising:
introducing the first substrate into a load lock while the second substrate is being processed by the vacuum tool, wherein a substrate handler is located between and connected to the load lock and the vacuum tool, the substrate handler and the vacuum tool being at a pressure lower than the load lock;
pumping down the load lock to a pressure substantially equal to the pressure of the substrate handler using a vacuum pump;
removing the first substrate from the load lock using a robot, the robot positioned inside the substrate handler;
placing the first substrate into a storage position in the substrate handler using the robot;
moving at least one substrate holder element at the storage position to engage the first substrate in the storage position.
16 . The method of claim 15 , wherein the step of placing the first substrate into the storage position comprises moving the first substrate upward substantially vertically to the storage position using the robot.
17 . The method of claim 15 , wherein the step of moving at least one substrate holder element comprises moving the at least one substrate holder element substantially horizontally.
18 . The method of claim 15 , further comprising lowering the robot substantially vertically after the first substrate has been engaged by the at least one substrate holder element.