Semiconductor wafer having a separation portion on a peripheral area
View Patent ↗A conveyance system for a semiconductor wafer can be used without any change before and after a support plate is adhered to the wafer. Also, the finish accuracy of the wafer and the positioning accuracy between the wafer and the support plate can be relaxed, thus improving the manufacturing efficiency. The wafer is formed on its peripheral portion with a stepped portion, which is deeper than a finished thickness obtained by partial removal of the rear surface thereof and which can be eliminated by the partial removal of the wafer rear surface. The separation portion has a length which extends radially outward from a flat surface, and which is greater than a total sum of a maximum-minimum difference between the finish allowances of the diameters of the wafer and the support plate, and a maximum value of a positioning error between the wafer and the support plate generated upon adhesion thereof.
1. A semiconductor wafer comprising:
a front surface and an opposing rear surface,
the front surface comprising a flat central portion and
a peripheral portion surrounding the flat central portion, wherein
a semiconductor circuit is formed in the flat central potion and
the peripheral portion comprises a stepped portion having vertical surface formed at an outer edge of the flat central portion, a front surface of the stepped portion formed horizontally to the vertical surface, an annular groove formed in the horizontally formed front surface at the vertical surface, and a chamfer formed where the vertical surface and the flat central portion meet.