Leadframe-based module DC bus design to reduce module inductance
View Patent ↗A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
1. A power module, comprising:
a positive conductor bus plate;
a negative conductor bus plate;
one or more materials interposed between the positive conductor bus plate and the negative conductor bus plate, said one or more materials providing at least one dielectric property;
a high side of a substrate operatively connected with the positive conductor bus plate; and
a low side of the substrate operatively connected with the negative conductor bus plate, wherein each of the positive and the negative conductor bus plates is physically positioned overlaying a space located between the high side of the substrate and the low side of the substrate,
wherein a DC device is operatively coupleable to the positive conductor bus plate and the negative conductor bus plate, and wherein an AC device is operatively coupleable to at least one set of phase terminals of the power module.
2. The power module of claim 1 , wherein the substrate comprises:
at least one switch for controlling current flow.
3. The power module of claim 1 , wherein the one or more materials providing at least one dielectric property has a dielectric strength of substantially 20 kV/mm or greater.
4. The power module of claim 1 , wherein the one or more materials providing at least one dielectric property provides a dielectric isolation from substantially 2 kV to substantially 5 kV.
5. The power module of claim 1 , wherein the one or more materials providing at least one dielectric property maintains the at least one dielectric property subsequent to injection molding.
6. The power module of claim 1 , wherein the one or more materials providing at least one dielectric property have a thickness ranging from substantially 0.1 mm to substantially 1.0 mm.
7. The power module of claim 1 , wherein the one or more materials interposed between a positive conductor bus plate and a negative conductor bus plate comprise:
a piece of a module frame.
8. The power module of claim 2 , wherein the at least one switch for controlling current flow comprises:
at least one power transistor.