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App. No. 11/246,402 · Confirmation No. 5207

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

Abandoned -- Incomplete Application (Pre-examination)
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 Code Description Pages PDF
2006-07-03 ABN Abandonment 2 View
2006-04-25 XT/ Extension of Time 1 View
2006-02-06 FRPR Certified Copy of Foreign Priority Application 30 View
2005-10-26 PEFN Pre-Exam Formalities Notice 2 View
2005-10-06 TRNA Transmittal of New Application 2 View
2005-10-06 SPEC Specification 32 View
2005-10-06 CLM Claims 5 View
2005-10-06 ABST Abstract 1 View
2005-10-06 DRW Drawings-only black and white line drawings 10 View
2005-10-06 WFEE Fee Worksheet (SB06) 1 View
2005-10-06 WFEE Fee Worksheet (SB06) 1 View
2005-10-06 ADS Application Data Sheet 4 View
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Quick Facts
App. No.
11/246,402
Filed
2005-10-06
Art Unit
3729