Patent Assignment
Reel/Frame 017575/0120
Change of Name
Recorded: 2006-05-03
Received: 2006-05-03
Pages: 3
Assignor
SOCKETSTRATE, INC.
Executed: 2006-02-28
Assignee
TESSERA INTERCONNECT MATERIALS, INC.
3099 ORCHARD DRIVE, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(16)
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
Application:
11/410,388 →
Apparatus and method for distributing a liquid onto a surface of an item
Application:
11/363,401 →
Method of manufacturing a multi-layer wiring board using a metal member having a rough surface
Application:
11/356,672 →
Canister hose reel
Application:
60/736,215 →
Structure and method of making interconnect element having metal traces embedded in surface of dielectric
Application:
11/246,402 →
Structure and Method of Making Interconnect Element, and Multilayer Wiring Board Including the Interconnect Element
Application:
11/239,744 →
Interlayer member used for producing multilayer wiring board and method of producing the same
Application:
11/085,108 →
Connecting Member Between Wiring Films, Manufacturing Method Thereof, and Manufacturing Method of Multilayer Wiring Substrate
Application:
11/029,423 →
Multilayer Wiring Board for an Electronic Device
Application:
10/880,588 →
Manufacturing Method for Wiring Circuit Substrate
Application:
10/823,611 →
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
Application:
10/812,349 →
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
Application:
10/450,844 →
Connecting Member Between Wiring Films, Manufacturing Method Thereof, and Manufacturing Method of Multilayer Wiring Substrate
Application:
10/358,229 →
Wiring Circuit Substrate and Manufacturing Method Therefor
Application:
10/287,633 →
Manufacturing Method for Wiring Circuit Substrates
Application:
10/139,237 →
Fabrication Method of Wiring Substrate for Mounting Semiconductor Element and Semiconductor Device
Application:
10/072,351 →