IP Library Patent Application 11356672
Patent Application Utility
App. No. 11/356,672 · Confirmation No. 5286

Method of manufacturing a multi-layer wiring board using a metal member having a rough surface

Abandoned -- Incomplete Application (Pre-examination)
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Code Description Pages PDF
2006-11-29 ABN Abandonment 2 View
2006-10-23 XT/ Extension of Time 1 View
2006-03-21 PEFN Pre-Exam Formalities Notice 2 View
2006-03-13 FRPR Certified Copy of Foreign Priority Application 19 View
2006-02-17 TRNA Transmittal of New Application 2 View
2006-02-17 SPEC Specification 13 View
2006-02-17 CLM Claims 5 View
2006-02-17 ABST Abstract 1 View
2006-02-17 DRW Drawings-only black and white line drawings 3 View
2006-02-17 WFEE Fee Worksheet (SB06) 1 View
2006-02-17 WFEE Fee Worksheet (SB06) 1 View
2006-02-17 ADS Application Data Sheet 3 View
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Quick Facts
App. No.
11/356,672
Filed
2006-02-17
Art Unit
3729