IP Library Patent Application 11585064
Patent Application Utility
App. No. 11/585,064 · Confirmation No. 7284

Method of manufacturing a multi-layer wiring board using a metal member having a rough surface

Abandoned -- Incomplete Application (Pre-examination)
⬇ PDF
Code Description Pages PDF
2011-02-24 WFEE Fee Worksheet (SB06) 1 View
2007-07-12 ABN Abandonment 2 View
2007-06-08 XT/ Extension of Time 1 View
2006-11-08 PEFN Pre-Exam Formalities Notice 2 View
2006-11-08 APP.FILE.REC Filing Receipt 3 View
2006-10-23 TRNA Transmittal of New Application 2 View
2006-10-23 SPEC Specification 13 View
2006-10-23 CLM Claims 5 View
2006-10-23 ABST Abstract 1 View
2006-10-23 DRW Drawings-only black and white line drawings 3 View
2006-10-23 WFEE Fee Worksheet (SB06) 1 View
2006-10-23 WFEE Fee Worksheet (SB06) 1 View
2006-10-23 ADS Application Data Sheet 3 View
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Quick Facts
App. No.
11/585,064
Filed
2006-10-23
Art Unit
3729