Method for fixed and replaceable module architecture
A method for implementing an electrical system architecture capable of providing fixed or modular components, for example, interface connectors, is provided. Fixed components allow product cost to be minimized. Modular components provide flexible configurability of products. In accordance with at least one embodiment of the present invention, an electrical system architecture capable of providing fixed or modular components minimizes costs such as design, production, and customer support costs while being able to provide a range of product variants.
1. A method comprising:
producing a circuit board;
determining whether the circuit board is to be populated to provide a first set of customer connectors or a first set of intermediate connectors;
when the circuit board is unpopulated and is to be populated to provide the first set of customer connectors, performing the following:
populating the circuit board with the first set of customer connectors
populating the circuit board with interface electronics to support an interface for the first set of customer connectors;
installing the circuit board in a customer-connector-compatible enclosure compatible with the first set of customer connectors;
when the circuit board is unpopulated and is to be populated to provide a first set of intermediate connectors, performing the following:
populating the circuit board with the first set of intermediate connectors;
installing module guides of a guide system on the circuit board;
installing the circuit board in an intermediate-connector-compatible enclosure compatible with the first set of intermediate connectors; and
when the circuit board has been populated to provide the first set of customer connectors and is to be populated to provide the first set of intermediate connectors, performing the following:
removing the circuit board from the customer-connector-compatible enclosure;
removing the first set of customer connectors;
populating the circuit board with the first set of intermediate connectors;
installing the module guides of the guide system on the circuit board;
installing the circuit board in the intermediate-connector-compatible enclosure compatible with the first set of intermediate connectors.
2. The method of claim 1 further comprising:
installing a module, wherein the module comprises a mating connector to connect to at least one of the intermediate connectors of the circuit board.
3. The method of claim 2 wherein the module provides a customer connector, wherein the customer connector is adapted to be externally accessible via an aperture defined by the intermediate-connector-compatible enclosure.
4. The method of claim 2 further comprising:
removing the module; and
installing a replacement module.
5. The method of claim 2 further comprising:
providing a mating guide of the guide system on the module, wherein the mating guide is adapted to engage at least one of the module guides.
6. The method of claim 5 wherein the guide system positions modules at a separation distance from the circuit board to enhance convective heat transfer.
7. The method of claim 6 wherein the guide system defines a perforation to enhance convective heat transfer.
8. A method comprising:
producing a circuit board;
determining whether the circuit board is to be populated to provide a first set of customer connectors or a first set of intermediate connectors;
when the circuit board is unpopulated and is to be populated to provide the first set of customer connectors, performing the following:
populating the circuit board with the first set of customer connectors
populating the circuit board with interface electronics to support an interface for the first set of customer connectors;
installing the circuit board in a customer-connector-compatible enclosure compatible with the first set of customer connectors;
when the circuit board is unpopulated and is to be populated to provide a first set of intermediate connectors, performing the following:
populating the circuit board with the first set of intermediate connectors;
installing module guides of a guide system on the circuit board;
installing the circuit board in an intermediate-connector-compatible enclosure compatible with the first set of intermediate connectors; and
when the circuit board is populated with the first set of intermediate connectors and is to be populated to provide the first set of customer connectors, performing the following:
removing the circuit board from the intermediate-connector-compatible enclosure;
removing the module guides of the guide system from the circuit board;
populating the circuit board with the first set of customer connectors; and
installing the circuit board in the customer-connector-compatible enclosure.
9. The method of claim 8 further comprising:
removing a module, wherein the module comprises a mating connector to connect to at least one of the intermediate connectors of the circuit board.
10. The method of claim 9 wherein the module provides a customer connector, wherein the customer connector is adapted to be externally accessible via an aperture defined by the intermediate-connector-compatible enclosure.
11. The method of claim 9 further comprising:
providing a mating guide of the guide system on the module, wherein the mating guide is adapted to engage at least one of the module guides.
12. The method of claim 11 wherein the guide system positions modules at a separation distance from the circuit board to enhance convective heat transfer.
13. The method of claim 12 wherein the guide system defines a perforation to enhance convective heat transfer.