Method and apparatus for a DUT contactor
A DUT contactor integrated into a DUT or probe board is presented. The DUT contactor integrated into a DUT/probe board may comprise a raised metallization contact layer on one surface of a multi-layer printed circuit board.
1 . A contactor integrated DUT board comprising:
a multi-layer printed circuit board having raised contactor pads on an outer layer of the multi-layer printed circuit board which are directly connectable to solder balls of a device under test (DUT) which is mountable thereon, and vias which are electrically coupled to the raised contactor pads.
2 . The DUT contactor integrated DUT board according to claim 1 , wherein the raised contactor pads are BECu.
3 . The DUT contactor integrated DUT board according to claim 1 , wherein the raised contactor pads are Phosphor Bronze.
4 . A method for manufacturing a DUT contactor integrated DUT board comprising the following steps:
forming a multi-layer printed circuit board;
forming vias in the multi-layer printed circuit board;
masking pads to correspond with contact balls on a DUT on an out layer of the multi-layer printed circuit board; and
etching the metallization to form contactor pads on the multi-layer printed circuit board.
5 . The contactor integrated DUT board according to claim 1 , wherein:
the DUT is mounted on the multi-layer printed circuit board such that the solder balls of the DUT are directly connected to the raised contactor pads.
6 . The contactor integrated DUT board according to claim 1 , wherein:
the vias of the multi-layer printed circuit board are connected to signal channels of a DUT tester.