Methods of forming a metal line in a semiconductor device

1. A method of forming a metal line in a semiconductor device, comprising:

sequentially depositing a first etch stop layer, an interlayer insulating layer, a second etch stop layer, and a line insulating layer over a semiconductor substrate;

forming a contact hole pattern on the line insulating layer;

forming a contact hole by etching an exposed portion of the line insulating layer, the second etch stop layer, and the interlayer insulating layer using the contact hole pattern as a mask;

forming a trench pattern on the line insulating layer;

forming a trench by etching an exposed portion of the line insulating layer using the trench pattern as a mask;

removing exposed portions of the first etch stop layer and the second etch stop layer after forming the contact hole and the trench;

forming a barrier metal layer in the contact hole and the trench;

forming a first metal seed layer on the barrier metal layer in a lower portion of the contact hole;

forming a first metal thin film only within the contact hole on the first metal seed layer;

forming a second metal seed layer on the barrier metal layer in the trench and a portion of the contact hole where the first metal thin film is absent; and

forming a second metal thin film on the second metal seed layer.

2. The method of claim 1 , wherein forming the first metal thin film comprises:

depositing a first metal material on entire exposed surfaces of the contact hole, the trench, and on the line insulating layer;

depositing a sacrificial layer on the first metal material;

etching the sacrificial layer to form an etched sacrificial layer covering a portion of the first metal material in the contact hole;

etching the first metal material using the etched sacrificial layer as a mask to form the first metal seed layer within the contact hole; and

forming the first metal thin film by removing the etched sacrificial layer and by performing electrolysis using the remaining portion of the first metal seed layer as an electrode.

3. The method of claim 2 , wherein a thickness of the etched sacrificial layer within the contact hole is greater than about a quarter of a sum of a depth of the trench and a depth of the contact hole.

4. The method of claim 2 , further comprising removing the sacrificial layer from the trench and a portion of the contact hole.

5. The method of claim 2 , wherein etching the first metal material removes the first metal material from an entire surface of the line insulating layer, an entire surface of the trench, and a partial surface of the contact hole.

6. The method of claim 2 , wherein the first metal seed layer comprises copper.

7. The method of claim 1 , wherein forming the second metal thin film comprises performing electrolysis using the second metal seed layer as an electrode.

8. The method of claim 1 , wherein the barrier metal layer is formed on inner walls of the contact hole and the trench, and on the line insulating layer.

9. The method of claim 8 , further comprising removing the second metal thin film, the second metal seed layer, and the barrier metal layer on the line insulating layer by chemical and mechanical polishing.

10. The method of claim 8 , wherein forming the barrier layer comprises depositing TaN.

11. The method of claim 8 , wherein the first metal material is deposited on the barrier metal layer to a thickness in the hundreds of Å.

12. The method of claim 1 , wherein the first and the second metal thin films comprise copper.

13. The method of claim 1 , wherein each of the first etch stop layer and the second etch stop layer comprises a silicon oxynitride (SiON) layer.

14. The method of claim 13 , wherein depositing each of the first and second etch stop layers comprises PECVD (Plasma Enhanced CVD).

15. The method of claim 1 , wherein the second metal seed layer comprises copper.

16. The method of claim 1 , wherein the first metal thin film comprises copper.

17. The method of claim 16 , wherein the second metal thin film comprises copper.

18. A method of forming a metal line in a semiconductor device using a dual damascene process, comprising:

sequentially forming a contact hole and a trench having a greater width than the contact hole on a semiconductor substrate having a device structure thereon;

forming a first metal seed layer on a portion of an inner wall of the contact hole;

forming a first metal thin film over the portion of the contact hole covered by the first metal seed layer;

forming a second metal seed layer on an entire upper surface of the semiconductor substrate where the first metal thin film is absent;

forming a second metal thin film on an entire upper surface of the semiconductor substrate having the second metal seed layer and the first metal thin film; and

removing portions of the second metal thin film and the second metal seed layer except portions of the second metal thin film and the second metal seed layer formed within the contact hole and the trench.

19. The method of claim 18 , further comprising forming a barrier metal layer on an entire upper surface of the semiconductor substrate after forming the contact hole and the trench.

20. The method of claim 18 , further comprising removing a portion of the barrier metal layer except a portion of the barrier metal layer formed within the contact hole and the trench.