Methods and apparatus for assembling a printed circuit board

1. A method for manufacturing a printed circuit board said method comprising:

providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface;

providing a plurality of surface mount components each comprising a plurality of electrical terminals;

applying an adhesive on a portion of the first surface of the board and adhering a first surface mount component to the first surface;

wave soldering the first surface of the board to mount the first surface mount component on the first surface, at least a portion of the electrical terminals of the first surface mount component encapsulated with a lead-free solder, and a first acute angle defined between the first surface of the board and a molten solder wave during said wave soldering, wherein the first acute angle is between about 4 degrees and about 12 degrees;

applying an adhesive on a portion of the second surface of the board and adhering a second surface mount component to the second surface, after wave soldering the first surface of the board; and

wave soldering the second side of the board to mount the second surface mount component on the second surface, at least a portion of the electrical terminals of the second surface mount component encapsulated with a lead-free solder, and a second acute angle defined between the second surface of the board and the molten solder wave during said wave soldering the second surface, wherein the second acute angle is between about 4 degrees and about 12 degrees.

2. A method in accordance with claim 1 further comprising flipping the board over after the first surface mount component is adhered to the first surface and before the first surface is wave soldered.

3. A method in accordance with claim 1 wherein said providing a plurality of surface mount components comprises providing at least one surface mount component having a plurality of electrical terminals comprising tin.

4. A method in accordance with claim 1 further comprising flipping the board after the second surface mount component is adhered to the second surface.

5. A method in accordance with claim 1 further comprising annealing the board after wave soldering the second surface mount component.

6. A method of assembling a printed circuit board, said method comprising:

providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface;

providing at least two surface mount components having a plurality of electrical terminals;

mounting a first surface mount component of the at least two surface mount components to the first surface of the board by adhering the first surface mount component to the first surface;

encapsulating at least a portion of the electrical terminals of the first surface mount component with a lead-free solder without utilizing a reflow soldering process, said encapsulating comprising wave soldering the first surface of the board such that a first acute angle is defined between the first surface of the board and a molten solder wave, the first acute angle between about 4 degrees and about 12 degrees;

mounting a second surface mount component of the at least two surface mount components to the second surface of the board by adhering the second surface mount component to the second surface, after encapsulating at least a portion of the electrical terminals of the first surface mount component; and

encapsulating at least a portion of the electrical terminals of the second surface mount component with a lead-free solder without utilizing the reflow soldering process, said encapsulating comprising wave soldering the second surface such that a second acute angle is defined between the second surface of the board and the molten solder wave, the second acute angle between about 4 degrees and about 12 degrees.

7. A method in accordance with claim 6 further comprising flipping the board over after the first surface mount component is mounted to the first surface and before the first surface mount component is encapsulated with the lead-free solder.

8. A method in accordance with claim 6 further comprising mounting at least one through-hole mount component onto the first surface of the board after encapsulating at least a portion of the electrical terminals of the first surface mount component.

9. A method in accordance with claim 8 further comprising encapsulating at least a portion of the at least one through-hole mount component without utilizing the reflow soldering process, said encapsulating performed using said wave soldering of the second surface.

10. A method in accordance with claim 8 further comprising flipping the board before the at least one through-hole mount component is mounted onto the first surface of the board.

11. A method in accordance with claim 8 further comprising simultaneously soldering the through-hole mount component and the second surface mount component to the board.

12. A method in accordance with claim 6 wherein said providing at least two surface mount components comprises providing at least one surface mount component having a plurality of electrical terminals comprising tin, the tin at least partially encapsulated by said lead-free solder.

13. A method in accordance with claim 6 further comprising annealing the board.

14. A method of fabricating a printed circuit board assembly, said method comprising:

providing a board including a plurality of electrical traces, a first surface, and a second surface opposite to the first surface;

providing a plurality of surface mount components, each surface mount component including a plurality of electrical terminals;

adhering a first surface mount component of the plurality of surface mount components to the first surface;

wave soldering the first surface of the board to mount the first surface mount component on the first surface, a first acute angle formed between the first surface of the board and a molten solder wave during said wave soldering, the first acute angle between about 4 degrees and about 12 degrees;

adhering a second surface mount component of the plurality of surface mount components to the second surface of the board after wave soldering the first surface of the board; and

wave soldering the second surface mount component on the second surface to the board, a second acute angle formed between the second surface of the board and the molten solder wave, the second acute angle between about 4 degrees and about 12 degrees.

15. A method in accordance with claim 14 wherein wave soldering the first surface mount component on the first surface further comprises encapsulating the plurality of electrical terminals of the first surface mount component with a lead-free solder.

16. A method in accordance with claim 14 further comprising preheating the board before wave soldering the first surface mount component on the first surface.

17. A method in accordance with claim 14 further comprising flipping the board before wave soldering the first surface mount component on the first surface.

18. A method in accordance with claim 14 further comprising mounting at least one through-hole mount component onto the first surface of the board after wave soldering the first surface mount component to the first surface by inserting an electrical terminal of the at least one through-hole mount component through the board from the first surface of the board toward the second surface of the board.

19. A method in accordance with claim 18 wherein wave soldering the second surface mount component on the second surface comprises wave soldering the through-hole mount component to the board.