Image pick-up inspection equipment and method
An objective lens system opposing an imaged surface of semiconductor device, and imaging lens system arranged between this objective lens system and image sensor is used to inspect a lower component of the semiconductor device without being influence by an upper component. The F value of objective lens system is made into 1.5 or less, and an imaged surface is photographed and inspected. The imaging lens system also has several lenses with different focal distances. According to the desired magnification, a predetermined lens among the plurality of lenses is arranged in the predetermined location of an optical axis, and the other lenses are evacuated from an optical axis.
1. An image pick-up inspection method of inspecting a semiconductor device, comprising the steps of:
performing illumination by a bright field on a surface of the semiconductor device including
a semiconductor chip having a pad on the surface thereof, and
a first electrical wire bonded on the pad; and
imaging the surface of the semiconductor device illuminated by the bright field with an objective lens system opposing the surface of the semiconductor device,
wherein the objective lens system has an F value of 1.5 or less to establish an image of the pad.
2. An image pick-up inspection method according to claim 1 , wherein
the semiconductor device further includes
a second electrical wire provided at a higher position than the first electrical wire and not bonded on the pad.
3. An image pick-up inspection method according to claim 2 , wherein the semiconductor device further includes at least one other semiconductor chip having a pad on which the second electrical wire is bonded, and the at least one other semiconductor chip is positioned over the surface of the semiconductor chip.
4. An image pick-up inspection method of inspecting a semiconductor device, comprising the steps of:
illuminating by a bright field a surface of the semiconductor device that includes,
a first semiconductor chip having a pad on a surface thereof; and
a first electrical wire being at a higher position than the pad; and
imaging the surface of the semiconductor device by the bright field with an objective lens system having an F value corresponding to an image fading of the first electrical wire to 5 or more times a diameter of the first electrical wire to establish an image of the pad.
5. An image pick-up inspection method according to claim 4 , wherein the objective lens system has the F value corresponding to an image fading of a top of a ball, which is situated on the pad of the semiconductor device and connected to the first electrical wire, to 2 or less times of a difference of a half of a width of the pad and a radius of the ball.
6. An image pick-up inspection method according to claim 4 , wherein the semiconductor device further includes a second electrical wire bonded on the pad while the first electrical wire is not bonded on the pad.
7. The image pick-up inspection method according to claim 4 , wherein the semiconductor device further includes a second semiconductor chip having a pad on which the second electrical wire is bonded, and the second semiconductor chip is arranged over the surface of the first semiconductor chip.
8. An image pick-up inspection method according to claim 1 , wherein, F value of the objective lens system is 1.0 or more.
9. An image pick-up inspection method of inspecting a semiconductor device, comprising:
illuminating by a bright filed a surface of the semiconductor device that includes a first semiconductor chip and a first electrical wire being provided over a surface of the first semiconductor chip; and
imaging the surface of the semiconductor device by the bright field with an objective lens system whose F value is so adjusted to make an image of the first electrical wire faded to an extent that a hidden portion of the surface of the semiconductor chip in an upper view by the first electrical wire is imaged.
10. An image pick-up inspection method according to claim 9 , wherein the semiconductor device further includes a second electrical wire bonded on a pad which is provided on the surface of the semiconductor chip and being provided at a position lower than the first electrical wire relatively to the surface of the semiconductor chip.
11. An image pick-up inspection method according to claim 10 , wherein the semiconductor device further includes a second semiconductor chip having a pad on which the second electrical wire is bonded, and the second semiconductor chip is arranged over the surface of the first semiconductor chip.