IP Library Assignment 024879/0423
Patent Assignment
Reel/Frame 024879/0423

Change of Name

Recorded: 2010-08-25 Pages: 24
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties (18)
Semiconductor device
Application: 11/157,863 →
Publication: US 2006/0001156
Semiconductor Device and Manufacturing Method Therefor
Patent: 7,602,063 →
Application: 11/172,871 →
Publication: US 2006/0006530
Semiconductor Chip Having Gettering Layer, and Method for Manufacturing the Same
Patent: 7,582,950 →
Application: 11/190,011 →
Publication: US 2006/0022321
Semiconductor Device Including a Laser Light Blocking Layer Which Overlaps Fuses
Patent: 7,667,290 →
Application: 11/237,772 →
Publication: US 2006/0076642
Manufacturing Method of Semiconductor Device
Patent: 7,443,036 →
Application: 11/241,986 →
Publication: US 2006/0134832
Image Pick-Up Inspection Equipment and Method
Patent: 7,627,241 →
Application: 11/263,917 →
Publication: US 2006/0170911
Semiconductor Device Having Soi Structure and Method for Manufacturing the Same
Patent: 7,511,342 →
Application: 11/341,444 →
Publication: US 2006/0180861
Manufacturing Method of a Semiconductor Device to Suppress Generation of Whiskers
Patent: 7,547,581 →
Application: 11/362,847 →
Publication: US 2007/0059916
Method for Manufacturing Semiconductor Device
Patent: 7,498,180 →
Application: 11/362,881 →
Publication: US 2006/0220668
Semiconductor Device and Method of Manufacturing the Same
Patent: 7,456,091 →
Application: 11/376,090 →
Publication: US 2006/0261495
Cu Wiring Formation Method
Application: 11/556,382 →
Publication: US 2007/0134920
Lateral Bipolar Transistor
Patent: 7,514,344 →
Application: 11/682,126 →
Publication: US 2007/0205487
Manufacturing Method of Semiconductor Device
Patent: 7,745,258 →
Application: 12/172,812 →
Publication: US 2008/0274590
Semiconductor Device and Method of Manufacturing the Same
Patent: 7,659,635 →
Application: 12/204,394 →
Publication: US 2009/0001572
Method for Manufacturing Semiconductor Device
Patent: 7,662,647 →
Application: 12/245,542 →
Publication: US 2009/0035881
Lateral Bipolar Transistor
Patent: 7,667,294 →
Application: 12/391,306 →
Publication: US 2009/0160025
Semiconductor Device and Manufacturing Method Therefor
Patent: 7,960,279 →
Application: 12/493,347 →
Publication: US 2009/0263963
Semiconductor Chip Having Gettering Layer, and Method for Manufacturing the Same
Application: 12/508,775 →
Publication: US 2009/0286354
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 22, 2005
From: WAKIYAMA, SATORU; BABA, SHINJI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016716/0637 →
Assignment of Assignor's Interest Jul 5, 2005
From: FURUSAWA, TAKESHI; MIURA, NORIKO; GOTO, KINYA; MATSUURA, MASAZUMI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016751/0654 →
Assignment of Assignor's Interest Jul 27, 2005
From: MATSUKAWA, KAZUHITO; KOGA, TSUYOSHI; NISHIDA, AKIO; HIGASHIDE, YOSHIKO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016817/0754 →
Assignment of Assignor's Interest Sep 29, 2005
From: IDO, YASUHIRO; IWAMOTO, TAKESHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017070/0021 →
Assignment of Assignor's Interest Oct 4, 2005
From: IWASAKI, TOSHIHIRO; KIMURA, MICHITAKA; HARADA, KOZO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017062/0689 →
Assignment of Assignor's Interest Nov 2, 2005
From: OKITA, TAKANORI; SUZUKI, KOUICHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017178/0614 →
Assignment of Assignor's Interest Jan 30, 2006
From: TSUJIUCHI, MIKIO; IWAMATSU, TOSHIAKI; MAEGAWA, SHIGETO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017522/0934 →
Assignment of Assignor's Interest Feb 28, 2006
From: IMAMURA, YUMI; YAMAMOTO, KENJI; MURAKAMI, TOMOHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017629/0361 →
Assignment of Assignor's Interest Feb 28, 2006
From: YAMASHITA, EISAKU; TAKADA, SHIGERU
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017625/0884 →
Assignment of Assignor's Interest Mar 16, 2006
From: KURAYA, HIDETOSHI; ARAKAWA, HIDEYUKI; AGA, FUMIAKI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017695/0076 →
Assignment of Assignor's Interest Mar 1, 2007
From: HIRANO, SHINYA; SUDO, YOSHIMI; IMAIZUMI, TETSUNORI; YOSHIDA, YASUHIRO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018948/0655 →
Assignment of Assignor's Interest Mar 5, 2007
From: IKEDA, TATSUHIKO
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018960/0242 →
Merger Aug 25, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0399 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →