Method of forming an insulating film, method of manufacturing a semiconductor device, and semiconductor device

1. A method of forming an insulating film, comprising:

forming a base film comprising a material whose surface is oxidized by being exposed to an oxidant;

alternately supplying a source gas containing a metal material and a first oxidant having a first oxidation force to form a first insulating film on the base film;

heating the first insulating film at a temperature higher than a processing temperature of forming the first insulating film between forming the first insulating film and forming a second insulating film;

alternately supplying a source gas containing a metal material and a second oxidant having a second oxidation force stronger than the first oxidation force to form the second insulating film on the first insulating film; and

forming a conductive film on the second insulating film.

2. The method according to claim 1 , wherein the first oxidant is water or oxygen or nitrogen monoxide.

3. The method according to claim 1 , wherein the second oxidant is ozone.

4. The method according to claim 1 , wherein the first oxidant is supplied one time or two times.

5. The method according to claim 1 , wherein the metal material contained in the source gas supplied when forming the first insulating film is the same as the metal material contained in the source gas supplied when forming the second insulating film.

6. The method according to claim 1 , wherein the first oxidant is water or oxygen or nitrogen monoxide, the second oxidant is ozone, and the first oxidant is supplied one time or two times.

7. The method according to claim 6 , wherein the metal material contained in the source gas supplied when forming the first insulating film is the same as the metal material contained in the source gas supplied when forming the second insulating film.

8. A method of manufacturing a semiconductor device, comprising:

forming a first insulating film on a semiconductor substrate;

forming a first conductive film comprising a material whose surface is oxidized by being exposed to an oxidant on the first insulating film;

alternately supplying a source gas containing a metal material and a first oxidant having a first oxidation force to form a second insulating film on the first conductive film;

heating the second insulating film at a temperature higher than a processing temperature of forming the second insulating film between forming the second insulating film and forming a third insulating film;

alternately supplying a source gas containing a metal material and a second oxidant having a second oxidation force stronger than the first oxidation force to form the third insulating film on the second insulating film; and

forming a second conductive film on the third insulating film.

9. The method according to claim 8 , wherein the first oxidant is water or oxygen or nitrogen monoxide.

10. The method according to claim 8 , wherein the second oxidant is ozone.

11. The method according to claim 8 , wherein the first oxidant is supplied one time or two times.

12. The method according to claim 8 , wherein the metal material contained in the source gas supplied when forming the second insulating film is the same as the metal material contained in the source gas supplied when forming the third insulating film.

13. The method according to claim 8 , wherein the first oxidant is water or oxygen or nitrogen monoxide, the second oxidant is ozone, and the first oxidant is supplied one time or two times.

14. The method according to claim 13 , wherein the metal material contained in the source gas supplied when forming the second insulating film is the same as the metal material contained in the source gas supplied when forming the third insulating film.