Lateral high-voltage transistor with vertically-extended voltage-equalized drift region
View Patent ↗A lateral high-voltage device in which conductive trench plates are inserted across the voltage-withstand region, so that, in the on state, the current density vectors have less convergence. This can help reduce on-resistance.
1. A lateral semiconductor device, comprising:
a carrier-emission structure, which emits carriers when the device is in an ON state; and
a voltage-withstand structure, through which carriers pass when the device is in the ON state, but which blocks voltage when the device is in the OFF state;
wherein said voltage-withstand structure includes first and second conductive trench electrodes separated by a volume of semiconductor material , said trench electrodes each providing substantially equal potential across a respective face of said voltage-withstand structure;
and wherein said carriers emitted by said carrier-emission structure pass through said first and second conductive trench electrodes.
2. The device of claim 1 , wherein said voltage-withstand structure extends along a lateral direction of predominant current vector, and said trench electrodes extend both in depth and also laterally normal to said current vector.
3. The device of claim 1 , wherein said carrier-emission structure includes an anode and a semiconductor diffusion abutting said anode.
4. The device of claim 1 , wherein said carrier-emission structure includes a source diffusion, a semiconductor channel which abuts said source diffusion, and a gate which is capacitively coupled to said channel.
5. The device of claim 1 , further comprising an electrical contact which receives carriers emitted by said carrier-emission structure, after said carriers have passed through said voltage-withstand region.
6. The device of claim 1 , further comprising third and fourth trench electrodes which adjoin said semiconductor volume and are insulated from it.
7. A lateral semiconductor device, comprsing:
a carrier-emission structure; and
a voltage-withstand structure, though which carriers emitted by said carrier-emission structure can pass, said voltage-withstand structure includes first and second conductive trench electrodes separated by a volume of semiconductor material; and
wherein said voltage-withstand structure extends along a lateral direction of predominant current vector, and said trench electrodes extend both in depth and also laterally normal to said current vector.