Substrate treatment method and substrate treatment apparatus
View Patent ↗A substrate treatment method is disclosed, which can effectively reduce the amount of charges accumulated on a substrate due to treatment of the substrate with a water-containing liquid. The method comprises the steps of: supplying a water-containing liquid to a substrate held generally horizontally by a substrate holding/rotating mechanism while rotating the substrate at a first rotation speed; and removing charges from the substrate after the water supplying step by performing a puddle process for a predetermined period by retaining a liquid film of a predetermined liquid on a surface of the substrate held generally horizontally by the substrate holding/rotating mechanism with the substrate being rotated at a second rotation speed lower than the first rotation speed or kept in a non-rotating state without further supplying the predetermined liquid to the liquid film.
1. A substrate treatment method, comprising the steps of:
supplying a water-containing liquid to a substrate held generally horizontally by a substrate holding/rotating mechanism while rotating the substrate at a first rotation speed; and
removing charges from the substrate after the water-containing liquid supplying step by performing a puddle process for a predetermined period by retaining a liquid film of a predetermined liquid on a surface of the substrate held generally horizontally by the substrate holding/rotating mechanism with the substrate being rotated at a second rotation speed lower than the first rotation speed or kept in a non-rotating state without further supplying the predetermined liquid to the liquid film.
2. A substrate treatment method as set forth in claim 1 , wherein
the predetermined liquid is the water-containing liquid.
3. A substrate treatment method as set forth in claim 2 , wherein
the water supplying step includes the step of supplying the water-containing liquid to the substrate from a water supply nozzle,
the method further comprising the step of reducing the rotation speed of the substrate from the first rotation speed to the second rotation speed or stopping the rotation of the substrate, and stopping the supply of the liquid from the water supply nozzle between the water-containing liquid supplying step and the charge removing step.
4. A substrate treatment method as set forth in claim 1 , wherein
the predetermined liquid is an organic solvent.
5. A substrate treatment method as set forth in claim 4 , wherein
the water supplying step includes the step of supplying the water-containing liquid to the substrate from a water supply nozzle,
the method further comprising, between the water supplying step and the charge removing step, the steps of:
stopping the supply of the liquid from the water supply nozzle;
supplying the organic solvent to the surface of the substrate from an organic solvent nozzle;
reducing the rotation speed of the substrate from the first rotation speed to the second rotation speed or stopping the rotation of the substrate; and
stopping the supply of the organic solvent to the substrate from the organic solvent nozzle.
6. A substrate treatment method as set forth in claim 1 , further comprising the step of drying the substrate by spinning off the liquid from the substrate surface by rotating the substrate at a third rotation speed higher than the first rotation speed by the substrate holding/rotating mechanism after the charge removing step.
7. A substrate treatment method as set forth in claim 1 , wherein in the puddle process, the liquid film of the predetermined liquid is retained on the surface of the substrate held by the substrate holding/rotating mechanism, and substantially no relative movement occurs between the surface of the substrate and the predetermined liquid constituting the liquid film during the puddle process.