IP Library Granted Patent US 7,593,564
Granted Patent B2
US 7,593,564 · App. 11/272,897 · Granted Sep 22, 2009

Method and apparatus for reviewing defect of subject to be inspected

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Quick Facts
Patent No.
US 7,593,564
App. No.
11/272,897
Granted
Sep 22, 2009
Kind
B2
Abstract

Absolute coordinates designate position coordinates of a defect of a calibrating substrate, and inspection coordinates designate position coordinates of the defect of the calibrating substrate detected by an inspection apparatus. A deviation of the inspection coordinates with respect to the absolute coordinates is an error included in the inspection coordinates. When “nonrandom errors” are removed from the inspection coordinates, a “random error” is left in the inspection coordinates. The view size for defect search in a defect reviewing apparatus is set based on the random error. Further, a defect for fine alignment is selected based on the tendency of a detected value of the defect size of the calibrating substrate detected by the inspection apparatus.

Claims (34)

1. A defect reviewing apparatus comprising:

an input unit for inputting inspection information of a defect to be inspected, said inspection information being obtained by an inspection apparatus;

a display unit for displaying a magnified image of said defect to be inspected, based on position coordinates of said defect, said position coordinates being input through said input unit; and

a defect data analyzing/computing portion for analyzing errors included in said position coordinates of said defect, wherein:

said defect data analyzing/computing portion determines a deviation of inspection coordinates with respect to absolute coordinates as an error caused by said inspection apparatus, estimates a random error based on said error, and sets a view size for defect search in said display unit based on said random error, when said absolute coordinates designate position coordinates of a defect in a known calibrating substrate, and said inspection coordinates designate position coordinates of said defect of said calibrating substrate detected by said inspection apparatus,

said input unit inputs a detected value of a defect size of said calibrating substrate detected by said inspection apparatus, and

said defect data analyzing/computing portion determines a correlation between said detected value of said defect size and a real value of said defect size measured in advance, and selects a defect in which said correlation is higher than a predetermined threshold value, as a defect suitable for fine alignment.

2. A defect reviewing apparatus comprising:

an input unit for inputting inspection information of a defect to be inspected, said inspection information being obtained by an inspection apparatus;

a display unit for displaying a magnified image of said defect to be inspected, based on position coordinates of said defect, said position coordinates being input through said input unit; and

a defect data analyzing/computing portion for analyzing errors included in said position coordinates of said defect, wherein:

said defect data analyzing/computing portion determines a deviation of inspection coordinates with respect to absolute coordinates as an error caused by said inspection apparatus, estimates a random error based on said error, and sets a view size for defect search in said display unit based on said random error, when said absolute coordinates designate position coordinates of a defect in a known calibrating substrate, and said inspection coordinates designate position coordinates of said defect of said calibrating substrate detected by said inspection apparatus,

said input unit inputs a detected value of a defect size of said calibrating substrate detected by said inspection apparatus, and

said defect data analyzing/computing portion selects a defect in which said deviation of said inspection coordinates with respect to said absolute coordinates is fixed regardless of said detected value of said defect size, as a defect suitable for fine alignment.

3. A defect reviewing method for inputting position coordinates of a defect obtained by an inspection apparatus and displaying a magnified image of said defect by means of a defect reviewing apparatus, the method comprising steps of:

preparing a calibrating substrate having a defect whose position has been known and whose coordinates are called absolute coordinates; and

detecting a position of said defect of said calibrating substrate by means of said inspection apparatus, and outputting said detected position as inspection coordinates,

wherein the method further comprises steps executed by a processor included in a defect data analyzing/computing portion disposed in said defect reviewing apparatus, the steps executed by the computer comprising:

comparing said inspection coordinates with said absolute coordinates, and determining a deviation between said inspection coordinates and said absolute coordinates as an error due to said inspection apparatus;

extracting nonrandom errors from said error, and removing said nonrandom errors from said inspection coordinates;

determining an error included in said inspection coordinates from which said nonrandom errors have been removed, as a random error;

setting a view size for defect search in said defect reviewing apparatus based on said random error included in said inspection coordinates;

determining a correlation between a detected value of a defect size of said calibrating substrate detected by means of said inspection apparatus and a real value of said defect size measured in advance; and

selecting a defect in which said correlation is higher than a predetermined threshold value, as a defect suitable for fine alignment.

4. A defect reviewing method for inputting position coordinates of a defect obtained by an inspection apparatus and displaying a magnified image of said defect by means of a defect reviewing apparatus, the method comprising steps of:

preparing a calibrating substrate having a defect whose position has been known and whose coordinates are called absolute coordinates; and

detecting a position of said defect of said calibrating substrate by means of said inspection apparatus, and outputting said detected position as inspection coordinates,

wherein the method further comprises steps executed by a processor included in a defect data analyzing/computing portion disposed in said defect reviewing apparatus, the steps executed by the processor comprising:

comparing said inspection coordinates with said absolute coordinates, and determining a deviation between said inspection coordinates and said absolute coordinates as an error due to said inspection apparatus;

extracting nonrandom errors from said error, and removing said nonrandom errors from said inspection coordinates;

determining an error included in said inspection coordinates from which said nonrandom errors have been removed, as a random error;

setting a view size for defect search in said defect reviewing apparatus based on said random error included in said inspection coordinates;

obtaining a deviation of said inspection coordinates with respect to said absolute coordinates; and

selecting a defect in which said deviation is fixed regardless of a detected value of a defect size of said calibrating substrate detected by means of said inspection apparatus, as a defect suitable for fine alignment.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →