Semiconductor device
View Patent ↗The present invention provides a semiconductor device comprising a semiconductor substrate, and transistors formed on the semiconductor substrate, wherein control electrode terminals constituting external electrode terminals of the transistors, and first electrode terminals which transmit output signals, are provided on a main surface of the semiconductor substrate, wherein the control electrode terminals are provided at least one, and a plurality of the first electrode terminals are arranged on one side and a plurality of the first electrode terminals are arranged on the other side with the control electrode terminals being interposed therebetween, wherein a portion including the control electrode terminals and a plurality of the first electrode terminals located on one side of the control electrode terminals constitute a first transistor portion, and wherein a portion including the control electrode terminals and a plurality of the first electrode terminals located on the other side of the control electrode terminals constitute a second transistor portion. The semiconductor device is quadrangular.
1. A power amplifying module, comprising:
a wiring board having wirings;
a semiconductor chip, including a power amplifying circuit, mounted over the wiring board;
an input pad of the power amplifying circuit formed in an input pad forming region of a main surface of the semiconductor chip; and
a plurality of first and second output pads of the power amplifying circuit arranged in first and second output pad forming regions of the main surface of the semiconductor chip, respectively;
wherein the input pad forming region is located between the first and second output pad forming regions; and
wherein the input pad and first and second output pads are electrically connected with the wiring of the wiring board via respective protruded electrodes.
2. The power amplifying module according to claim 1 , wherein the protruded electrodes are bump electrodes.
3. The power amplifying module according to claim 1 , wherein the semiconductor chip has a plurality of the input pads in the input pad forming region of the semiconductor chip.
4. The power amplifying module according to claim 1 , including a plurality of power amplifying circuit transistor stages.
5. The power amplifying module according to claim 1 ,
wherein the power amplifying circuit comprises a field effect transistor;
the input pad is electrically connected to a gate electrode of the field effect transistor; and
the first and second output pads are electrically connected to a drain region of the field effect transistor.
6. The power amplifying module according to claim 1 , and which is employed in a wireless communication apparatus.
7. A semiconductor chip including a power amplifying circuit, comprising:
an input pad of the amplifying circuit formed in an input pad forming region of a main surface of the semiconductor chip;
a plurality of first output pads and a plurality of second output pads of the amplifying circuit arranged in first and second output pad forming regions of the main surface of the semiconductor chip, respectively;
wherein the input pad forming region is located between the first and second output pad forming regions; and
wherein respective protruded electrodes are formed over the input pad and the first and second output pads.
8. The semiconductor chip according to claim 7 , wherein the protruded electrodes are bump electrodes.
9. The semiconductor chip according to claim 7 , wherein the semiconductor chip has a plurality of the input pads in the input pad forming region.
10. The semiconductor chip according to claim 7 ,
wherein the power amplifying circuit includes a field effect transistor;
the input pad is electrically connected to a gate electrode of the field effect transistor; and
the first and second output pads are electrically connected to a drain region of the field effect transistor.