IP Library Granted Patent US 7,415,859
Granted Patent B2
US 7,415,859 · App. 11/289,648 · Granted Aug 26, 2008

Method and apparatus for forming blind holes in sheet material

Assignee: Metalform Asia PTE Ltd.
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Quick Facts
Patent No.
US 7,415,859
App. No.
11/289,648
Granted
Aug 26, 2008
Kind
B2
Abstract

A method of forming blind holes in a sheet material is provided. The method includes forming a recessed segment in the sheet material, stamping the recessed segment between a tapered punch and a pad to form a blind hole having a sealed end and a sidewall, wherein the pad includes a profiling pin that is enclosed by the sealed end and the sidewall. The method further includes forming a material channel interposed between the tapered punch and a tapered die, and compressing the material channel to generate a material flow into the sidewall. The material channel may be narrowed to allow more material flow into the sidewall for additional sidewall thickness.

Claims (19)

1. A method for forming a blind hole in a sheet of material, comprising;

placing a sheet material between a first upper die and a first lower die;

punching a recess punch into a through opening in said first upper die, to force a portion of said sheet material against a recess pad that inserts into a portion of a through opening of said first lower die to form a recess segment;

placing said sheet material between a second upper die and a second lower die;

punching down a tapered punch into a through opening of said second upper die, scraping a portion of material along a sidewall of said recess segment downwardly;

compressing said portion of material onto said recess segment of said sheet material against a support pad that inserts into a portion of a through opening of said second lower die to form a material channel between said sheet material and recess segment of said sheet material, wherein said tapered punch has an edge that inclines inward, and edges surrounding a top surface of said through opening of said second lower die are chamfered; and

defining a sidewall at an open end of said recess segment with a support portion of said support pad while a profiling pin of said support pad determines a height of said sidewall of an open end of said recess segment to form a blind hole on a bottom surface of said recess segment.

2. The method as recited in claim 1 , wherein a top surface of said recess segment is lower than a bottom surface of other portions of said sheet material.

3. The method as recited in claim 1 , wherein said material channel is constricted to a thickness less than that of a sidewall of said recess segment.

4. A system for forming a blind hole in a sheet material, comprising:

a first upper die with a through opening;

a first lower die with a through opening, wherein said sheet metal is placed between said first upper die and said first lower die;

a recess pad that inserts into a portion of said through opening of said first lower die; a recess punch that inserts into said through opening of said first upper die, wherein said recess punch forces a portion of said sheet material against said recess pad to form a recess segment;

a second upper die with a through opening;

a second lower die with a through opening, wherein said through opening of said second lower die has a chamfered edge;

a tapered punch that inserts into said through opening of said second upper die, wherein said tapered punch has a tapered edge that inclines inward;

a support pad that inserts into a portion of said second lower die, wherein said tapered punch forces a portion of said sheet material placed between said second upper die and said second lower die against said support pad to form a blind hole on a bottom surface of said recess segment.

5. The system as recited in claim 4 , wherein said support pad comprises a support portion.

6. The system as recited in claim 4 , wherein said support pad comprises a profiling pin.

Assignments (4)
CHANGE OF NAME Recorded Mar 10, 2014
From: GSLBU SINGAPORE PTE. LTD.
To: MMI PRECISION FORMING PTE. LTD.
Reel/Frame 032423/0346 →
CHANGE OF NAME Recorded Feb 26, 2013
From: GSLBU SINGAPORE PTE. LTD
To: MMI PRECISION FORMING PTE. LTD.
Reel/Frame 029877/0084 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2010
From: METALFORM ASIA PTE LTD.
To: GSLBU SINGAPORE PTE. LTD.
Reel/Frame 024990/0317 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2006
From: SER, SONG CHEH; LEONG, WENG HOW
To: METALFORM ASIA PTE LTD.
Reel/Frame 017567/0153 →
Priority Claims (2)
SG 200407251-8 · Dec 1, 2004 · national
SG 200502892-3 · Mar 18, 2005 · national
Continuity (1)
Related Publication 20060236519A1 · Oct 26, 2006