IP Library Granted Patent US 7,642,561
Granted Patent B2
US 7,642,561 · App. 11/294,403 · Granted Jan 5, 2010

Semiconductor light emitting diode having efficiency and method of manufacturing the same

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Quick Facts
Patent No.
US 7,642,561
App. No.
11/294,403
Granted
Jan 5, 2010
Kind
B2
Abstract

Provided is a semiconductor light emitting diode having a textured structure formed on a substrate. In a method of manufacturing the semiconductor light emitting diode, a metal layer is formed on the substrate, and a metal oxide layer having holes is formed by anodizing the metal layer. The metal oxide layer itself can be used as a textured structure pattern, or the textured structure pattern can be formed by forming holes in the substrate or a material layer under the metal oxide layer corresponding to the holes of the metal oxide layer. The manufacture of the semiconductor light emitting diode is completed by sequentially forming a first semiconductor layer, an active layer, and a second semiconductor layer on the textured structure pattern.

Claims (7)

1. A semiconductor light emitting diode having a textured structure, comprising:

a substrate;

a textured structure layer formed of a metal oxide on the substrate and having a plurality of holes formed to expose portions of the substrate;

a first semiconductor layer formed on the textured structure layer and the exposed portions of the substrate; and

an active layer and a second semiconductor layer sequentially formed on the first semiconductor layer.

2. The semiconductor light emitting diode of claim 1 , wherein the substrate is formed of one selected from an inorganic crystal that includes sapphire (Al 2 O 3 ), silicon (Si), silicon carbide (SiC), spinel (MgAl 2 O 4 ), NdGaO 3 , LiGaO 2 , ZnO, or MgO, an Ill-V group compound semiconductor that includes GaP or GaAs, and an Ill group nitride compound semiconductor that includes GaN.

3. The semiconductor light emitting diode of claim 1 , wherein the first semiconductor layer, the active layer, and the second semiconductor layer comprise a nitride semiconductor.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →