IP Library Granted Patent US 7,371,597
Granted Patent B2
US 7,371,597 · App. 11/298,507 · Granted May 13, 2008

Diode having vertical structure and method of manufacturing the same

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Quick Facts
Patent No.
US 7,371,597
App. No.
11/298,507
Granted
May 13, 2008
Kind
B2
Abstract

A light emitting diode includes a conductive layer, an n-GaN layer on the conductive layer, an active layer on the n-GaN layer, a p-GaN layer on the active layer, and a p-electrode on the p-GaN layer. The conductive layer is an n-electrode.

Claims (27)

1. A method of making a diode, comprising:

forming a first n-GaN layer on a substrate;

forming an active layer on the first n-GaN layer;

forming a p-GaN layer on the active layer;

separating the substrate from the first n-GaN layer;

forming an n-type contact layer on the n-GaN layer;

forming a p-electrode on the p-GaN layer,

wherein the n-type contact layer acts as a reflective layer to reflect light from the active layer.

2. The method according to claim 1 , wherein the p-electrode is formed prior to separating the substrate.

3. The method according to claim 1 , further comprising forming a second n-GaN layer between the substrate and the first n-GaN layer.

4. The method according to claim 3 , wherein the second n-GaN is formed using MOCVD.

5. The method according to claim 1 , wherein the substrate includes sapphire.

6. The method according to claim 1 , wherein the substrate is separated from the first n-GaN using a laser.

7. The method according to claim 1 , further comprising forming a transparent conductive layer between the p-electrode and the p-GaN layer.

8. A method of forming a diode, comprising:

forming an second GaN layer on a substrate having a first Gan layer;

forming an active layer on the second GaN layer;

forming a third GaN layer on the active layer;

separating the substrate from the first GaN layer; and

forming a first electrode on the first GaN layer where the substrate was separated;

wherein the first electrode is a reflective layer to reflect light from the active layer.

9. The method according to claim 8 , wherein the second GaN layer is formed on the first GaN layer using MOCVD.

10. The method according to claim 8 , wherein the second GaN layer is epitaxially grown on the substrate.

11. The method according to claim 8 , wherein the substrate is separated using laser.

12. The method according to claim 8 , wherein the active layer includes a multiple quantum well.

13. The method according to claim 8 , wherein the substrate includes sapphire.

14. The method according to claim 8 , wherein the first electrode includes aluminum.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2013
From: LG ELECTRONICS, INC.
To: LG INNOTEK CO. LTD.
Reel/Frame 031410/0169 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2005
From: WU, CAROL W., TRUSTEE IN BANKRUPTCY OF THE ESTATE OF ORIOL, INC.)
To: LG ELECTRONICS INC.
Reel/Frame 017355/0971 →