Process condition sensing wafer and data analysis system
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
1. A system for sensing processing conditions comprising: a substrate; a plurality of sensors attached to the substrate; an electronics platform electrically coupled to the plurality of sensors; the electronics platform having an enclosure that encloses at least one integrated circuit, the enclosure including a thermally insulating volume; and the electronics platform mounted to the substrate by one or more legs that elevate the platform from the substrate, wherein the enclosure is above the one or more legs, so that a bottom surface of the enclosure is above a top surface of the substrate.
2. The system of claim 1 wherein the thermally insulating volume is in fluid communication with an external volume that is external to the enclosure.
3. The system of claim 2 wherein the thermally insulating volume is evacuated as the external volume is evacuated.
4. The system of claim 1 wherein the thermally insulating volume is filled with a material having a low coefficient of thermal conductivity.
5. The system of claim 4 wherein the enclosure is hermetically sealed.
6. The system of claim 1 wherein the enclosure has an outer surface that is reflective to radiant heat.
7. The system of claim 1 further comprising a phase change material within the enclosure.
8. The system of claim 1 wherein the substrate is comprised of glass.
9. The system of claim 1 wherein the one or more legs have a height of less than one millimeter.
10. The system of claim 1 , wherein the enclosure is made of the same material as the one or more legs.
11. The system of claim 1 , wherein the one or more legs are made of a material having low thermal conductivity.