Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength
In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate.
1. A device comprising:
a base;
a first insulating layer on said base;
a first electrode on said first insulating layer;
a dielectric film on said first electrode;
a second electrode on said dielectric film; and
a second insulating layer on said second electrode,
wherein:
an adhesion hole set extends in a vertical direction through said first electrode, said dielectric film, and said second electrode;
a portion of said second insulating layer contacts said first insulating layer within said adhesion hole set;
said first insulating layer and said second insulating layer fill said adhesion hole set to the exclusion of any other material;
said first electrode, said dielectric film, and said second electrode form a structure having a cross-sectional area lying in a horizontal dimension that is substantially perpendicular to the vertical direction;
the cross-sectional area is bounded by a perimeter, and
said adhesion hole set is entirely contained within said perimeter.
2. The device of claim 1 , wherein said first insulating layer and said second insulating layer comprise the same material.
3. The device of claim 1 , wherein said adhesion hole set consists of one adhesion hole.
4. The device of claim 3 , wherein
a cross-sectional shape of said one adhesion hole is selected from the group consisting of circular, square, rectangular, diamond, and triangular.
5. The device of claim 1 , wherein the thickness of said first electrode is in the range from 10 to 100 microns.
6. The device of claim 1 , wherein the thickness of said dielectric film is in the range from 1 to 5 microns.
7. The device of claim 1 , wherein the thickness of said second electrode is in the range from 10 to 20 microns.
8. The device of claim 1 , wherein said adhesion hole set comprises a uniform pitch.
9. An electronic package comprising:
a device having a capacitor coupled to a substrate;
a first material above said capacitor;
a second material below said capacitor;
a microprocessor die coupled to a first side of said device; and
a motherboard coupled to a second side of said device,
wherein:
said capacitor extends in a vertical direction between said first material and said second material;
the capacitor has a cross-sectional area lying in a horizontal dimension that is substantially perpendicular to the vertical direction;
the cross-sectional area is bounded by a perimeter;
said capacitor comprises an adhesion hole set, said adhesion hole set being entirely contained within the perimeter of said cross-sectional area; and
said first material and said second material:
contact each other through said adhesion hole set; and
fill said adhesion hole set to the exclusion of any other material.
10. The electronic package of claim 9 , wherein said adhesion hole set comprises a first adhesion hole and a second adhesion hole.
11. The electronic package of claim 10 , wherein the area of said first adhesion hole is greater than the area of said second adhesion hole.
12. The electronic package of claim 10 , wherein the shape of said first adhesion hole is similar to the shape of said second adhesion hole.
13. The device of claim 9 ,wherein
the capacitor further comprises a first electrode, a second electrode over the first electrode, and a dielectric film between the first electrode and the second electrode;
the device further comprises a via; and
the via extends through the substrate, the first electrode, the dielectric film, and the second electrode.