Ferroelectric type semiconductor device having a barrier TiO and TiON type dielectric film
View Patent ↗A semiconductor device includes a semiconductor substrate, a first electrode that is formed over said semiconductor substrate, a capacitive insulating film that is formed on the first electrode and is made of a metal oxide ferroelectric, a second electrode that is formed on the capacitive insulating film, an insulating film that has a first opening exposing a portion of an upper side of the second electrode and is formed so that it covers the first electrode, the capacitive insulating film, and the second electrode, a first barrier film having an amorphous structure which is formed inside the first opening and on the insulating film, and a wiring film that is formed over the first barrier film.
1. A semiconductor device, comprising:
a semiconductor substrate;
a first electrode that is formed over said semiconductor substrate;
a capacitive insulating film that is formed on said first electrode and is comprised of a metal oxide ferroelectric;
a second electrode that is formed on said capacitive insulating film;
an insulating film that has a first opening which exposes a portion of an upper side of said second electrode and is formed so as to cover said first electrode, said capacitive insulating film, and said second electrode;
a first barrier film that is formed inside said first opening and on said insulating film;
a second barrier film that is formed by oxidizing a surface of said first barrier film; and
a wiring film that is formed above said first barrier film and said second barrier film, and is electrically connected to the second electrode through the first and second barrier films,
wherein the wiring film, the first barrier film and the second barrier film constitute one interconnection layer,
wherein said first barrier film is comprised of TiN, and
wherein said second barrier film is either a laminated film comprised of TiO 2 and Ti x O y N z or a single layer film comprised of Ti x O y N z .
2. The semiconductor device according to claim 1 , further comprising a second opening which exposes a portion of an upper side of said first electrode, and wherein said first barrier film and said second barrier film are formed inside said second opening.
3. The semiconductor device according to claim 2 , further comprising a reaction film provided on said second barrier film.
4. The semiconductor device according to claim 1 , further comprising a reaction film provided on said second barrier film.
5. The semiconductor device according to claim 4 , wherein said reaction film is comprised of at least one material selected from the group consisting of Ti, Mg, Mn, Ni, Hf, Li, Sc, Zr, Si, Pb, Nb, Zn, Sr, In, and Ag, and forms an alloy layer by chemically reacting with said wiring film.