Heat dissipation device
View Patent ↗A heat dissipation device includes a heat conducting plate ( 100 ) for contacting with an electronic component ( 400 ), a heat sink ( 200 ) mounted on the heat conducting plate and a heat pipe ( 300 ). The heat conducting plate comprises a groove ( 110 ) defined in. The heat pipe comprises an evaporating portion ( 310 ) sandwiched between the heat conducting plate and the heat sink, and a condensing portion ( 320 ) thermally connecting with the heat sink. The evaporating portion comprises a middle portion ( 3104 ) having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions ( 3102 ) formed on opposite sides of the middle portion. The end portions have flat bottom surfaces.
1. A heat dissipation device comprising:
a heat conducting plate adapted for contacting with an electronic component, the heat conducting plate comprising a groove defined therein;
a heat sink mounted on the heat conducting plate; and
a heat pipe comprising an evaporating portion sandwiched between the heat conducting plate and the heat sink, and a condensing portion thermally engaging with the heat sink, the evaporating portion comprising a middle portion having a circular cross section and accommodated in the groove of the heat conducting plate, and a pair of end portions formed on opposite sides of the middle portion, each of the end portions having a semi-circular cross section and a flat surface formed thereon;
wherein the end portions of the evaporating portion of the heat pipe are located outside two opposite sides of the heat conducting plate, respectively;
wherein the heat sink comprises a base facing the heat conducting plate and a plurality of fins mounted on the base;
wherein the base comprises a groove defined therein and aligned with the groove of the heat conducting plate to receive the evaporating portion of the heat pipe; and
wherein the flat surfaces of the end portions are coplanar with a bottom surface of the heat sink.
2. The heat dissipation device as claimed in claim 1 , wherein at least one cut is formed on at least one side of the groove of the base.
3. The heat dissipation device as claimed in claim 2 , wherein at least one expanded segment is formed on at least one side of the end portions of the heat pipe and received in the at least one cut of the base.
4. The heat dissipation device as claimed in claim 1 , wherein the heat sink further comprises a cover mounted on the fins.
5. A heat dissipation device comprising:
a heat conducting plate having a bottom face adapted for contacting with a heat-generating electronic component, and a top face defining a groove therein;
a heat sink mounted on the heat conducting plate; and
a heat pipe having an evaporation portion with a first portion received in the groove and thermally connecting with the heat conducting plate and a second portion outside the groove, the second portion having a bottom which is located above a bottom of the first portion, and a condensing portion thermally connecting with the heat sink;
wherein the evaporating portion of the heat pipe has a linear configuration and the first portion and the second portion are in line with each other and both located under the heat sink;
wherein the bottom of the second portion is flat, and the bottom of the first portion is curved;
wherein the flat bottom of the second portion is configured for receiving another electronic component therebelow; and
wherein the flat bottom of the second portion is substantially coplanar with a bottom face of the heat sink.
6. The heat dissipation device as claimed in claim 5 , wherein the another electronic component is a capacitor.