Light emitting diode package with protective function against electrostatic discharge
View Patent ↗An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
1. A Light Emitting Diode (LED) package having a protective function against electrostatic discharge comprising:
a submount with first and second electrode patterns formed thereon;
an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and
an MEMS switch including a first conductive plate disposed on the submount and a second conductive plate disposed apart from the first conductive plate on the submount and bent to have an area over and vertically apart from the first conductive plate, wherein the first conductive plate is electrically connected to one of the first and second electrode patterns, and the second conductive plate is electrically connected to the other electrode pattern, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
2. The LED package according to claim 1 , wherein the submount comprises a silicon substrate and a SiO 2 film formed on the silicon substrate.
3. The LED package according to claim 2 , wherein the first and second conductive plates are integrally formed with the submount, and electrically connected to the first and second electrode patterns, conductive patterns on the submount, respectively.
4. The LED package according to claim 1 or 3 , wherein the submount further comprises conductive patterns formed on the submount, electrically connecting the first conductive plate to one of the first and second electrode patterns and electrically connecting the second conductive plate to the other electrode pattern.
5. The LED package according to claim 1 , wherein the first and second conductive plates are made of metal.
6. The LED package according to claim 5 , wherein the first and second conductive plates are made of Al.
7. The LED package having according to claim 1 , wherein the second conductive plate is made of poly-silicon.
8. The LED package according to claim 1 , wherein the predetermined level of voltage is up to 30V.
9. The LED package according to claim 1 , further comprising a reflector formed around the LED on the submount for reflecting the light emitted from the LED upward.