Wireless communication devices and methods of forming and operating the same
The present invention relates to wireless communication devices and methods of forming and operating the same. The present invention provides a wireless communication device including a substrate having a support surface, wireless communication circuitry upon the support surface of the substrate, at least one antenna electrically coupled with the wireless communication circuitry, a conductive layer configured to interact with the antenna, and an insulative layer intermediate the conductive layer and the antenna. A method of forming a wireless communication device includes providing a substrate having a support surface, forming an antenna upon the support surface, conductively coupling wireless communication circuitry with the antenna, forming an insulative layer over at least a portion of the antenna, and providing a conductive layer over at least a portion of the insulative layer.
1 . A wireless communication device comprising:
a substrate having a support surface;
wireless communication circuitry upon the support surface of the substrate;
at least one antenna electrically coupled with the wireless communication circuitry;
a conductive layer configured to interact with the at least one antenna; and
an insulative layer intermediate the conductive layer and the at least one antenna.
2 . The wireless communication device according to claim 1 wherein the wireless communication device comprises a remote intelligent communication device.
3 . The wireless communication device according to claim 1 wherein the wireless communication device comprises a radio frequency identification device.
4 . The wireless communication device according to claim 1 wherein the insulative layer is over substantially the entire support surface and the conductive layer is over substantially the entire insulative layer.
5 . The wireless communication device according to claim 1 further comprising a power source having plural terminals coupled with the wireless communication circuitry.
6 . The wireless communication device according to claim 5 further comprising an electrical connection provided through the insulative layer and operable to conductively couple the conductive layer and one of the terminals of the power source.
7 . The wireless communication device according to claim 1 wherein the insulative layer forms a first encapsulant layer operable to envelope the wireless communication circuitry, the at least one antenna and the support surface.
8 . The wireless communication device according to claim 7 further comprising a second encapsulant layer over the conductive layer.
9 . The wireless communication device according to claim 8 wherein the first and second encapsulant layers and the substrate form a substantially solid housing.
10 . The wireless communication device according to claim 1 wherein the wireless communication circuitry comprises transponder circuitry configured to transmit an identification signal responsive to receiving a polling signal.
11 . The wireless communication device according to claim 1 further comprising a processor operable to process signals received via the at least one antenna.
12 . The wireless communication device according to claim 1 wherein the at least one antenna and conductive layer include respective peripheral edges and the peripheral edges of the at least one antenna are provided within the confines of the peripheral edges of the conductive layer.
13 . The wireless communication device according to claim 1 wherein the at least one antenna defines a plane, the conductive layer is substantially planar, and the conductive layer is substantially parallel to the plane defined by the at least one antenna.
14 . The wireless communication device according to claim 1 wherein the at least one antenna is operable to receive wireless communication signals and the conductive layer is configured to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.
15 . A remote intelligent communication device comprising:
a substrate having a support surface;
a conductive trace formed upon the support surface and including at least one antenna configured to at least one of transmit and receive wireless communication signals;
transponder circuitry bonded to the support surface and electrically coupled with the conductive trace;
a first encapsulant layer enveloping the transponder circuitry, the at least one antenna, and at least a portion of the substrate;
a conductive layer positioned upon the first encapsulant layer to interact with the at least one antenna; and
a second encapsulant layer over the conductive layer and forming a substantially solid housing with the substrate and the first encapsulant layer.
16 . The remote intelligent communication device according to claim 15 further comprising a power source coupled with the transponder circuitry.
17 . The remote intelligent communication device according to claim 15 further comprising an electrical connection through the first encapsulant layer coupling the conductive layer and the conductive trace.
18 . The remote intelligent communication device according to claim 15 further comprising a processor operable to process at least some of the wireless communication signals.
19 . The remote intelligent communication device according to claim 15 wherein the transponder circuitry is configured to transmit an identification signal responsive to receiving a polling signal.
20 . The remote intelligent communication device according to claim 15 wherein the conductive layer is configured to shield some of the wireless communication signals from the at least one antenna and reflect others of the wireless communication signals toward the at least one antenna.