Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass
View Patent ↗An exemplary manufacturing method of an inter-metal dielectric of a semiconductor device according to an embodiment of the present invention includes forming a first silicon-rich oxide (SRO) layer on a silicon substrate provided with or otherwise having a copper line layer therein, forming a plasma enhanced fluorosilicate glass (PEFSG) layer on the first SRO layer, plasma-treating the PEFSG layer, and forming a second SRO layer on the plasma-treated PEFSG layer. According to the present invention, the thickness of the second SRO layer of the inter-metal dielectric can be reduced. Consequently, process cost can be reduced, and the total thickness of the inter-metal dielectric can be reduced so as to lower the dielectric constant thereof, reduce the aspect ratio of any via holes that are subsequently formed in the inter-metal dielectric, and potentially increase the yield as a result of the reduced via hole aspect ratio.
1. A method of manufacturing a dielectric layer in a semiconductor device, comprising:
forming a first silicon-rich oxide (SRO) layer on a silicon substrate having a copper line layer therein;
forming a plasma enhanced fluorosilicate glass (PEFSG) layer on the first SRO layer;
forming a passivation layer which suppresses a fluorine-outgassing at an upper surface of the PEFSG layer by plasma-treating the PEFSG layer with a first plasma containing an oxygen source and subsequently with a second plasma containing a source of nitrogen and oxygen; and
forming a second silicon-rich oxide (SRO) layer on the plasma-treated PEFSG layer.
2. The manufacturing method of claim 1 , further comprising, before forming the first silicon rich oxide (SRO) layer, forming a silicon nitride layer.
3. The manufacturing method of claim 2 , wherein the silicon nitride layer provides an etch-stop function.
4. The manufacturing meted of claim 1 , wherein the first plasma comprises an oxygen (O 2 ) plasma.
5. The manufacturing method of claim 1 , wherein the second plasma comprises a nitrogen oxide plasma.
6. The manufacturing method of claim 1 , wherein plasma-treating the PEFSG layer comprises sequentially treating the PEFSG layer with an oxygen plasma and a nitrogen oxide plasma.
7. The manufacturing method of claim 1 , wherein the first SRO layer has a thickness of 300-500 Å, and the PEFSG layer has a thickness of 3000-6000 Å.
8. The manufacturing method of claim 1 , wherein the second SRO layer has a thickness of 1000-2000 Å.
9. The manufacturing method of claim 1 , wherein the first SRO layer has a thickness of 300-500 Å, the PEFSG layer has a thickness of 3000-6000 Å, and the second SRO layer has a thickness of 1000-2000 Å.
10. A dielectric layer in a semiconductor device, comprising;
a first silicon-rich oxide (SRO) layer on a silicon substrate having a copper layer therein;
a plasma enhanced fluorosilicate glass (PEFSG) layer on the first SRO layer;
a passivation layer on the surface of the PEFSG layer to suppress a fluorine-outgassing at an upper surface of the PEFSG layer, wherein the passivation layer is formed by sequentially treating the PEFSG layer with a first plasma containing an oxygen source and a second plasma containing a source of nitrogen and oxygen; and
a second SRO layer on the passivation layer.
11. The dielectric layer of claim 10 , wherein the passivation layer comprises a plasma-treated surface of the PEFSG layer.
12. The dielectric layer of claim 10 , further comprising a silicon nitride layer under the first SRO layer.
13. The dielectric layer of claim 10 , wherein the first SRO layer has a thickness of 300-500 Å, and the PEFSG layer has a thickness of 3000-6000 Å.
14. The dielectric of claim 10 , wherein the second SRO layer has a thickness of 1000-2000 Å.
15. The dielectric of claim 10 , wherein the first SRO layer has a thickness of 300-500 Å, the PEFSG layer has a thickness of 3000-6000 Å, and the second SRO layer has a thickness of 1000-2000 Å.