Side view LED package having lead frame structure designed to improve resin flow
View Patent ↗The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin.
1. A side view Light Emitting Diode (LED) package comprising:
an LED chip;
a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof, the LED chip mounted on a surface of the lead frame; and
an integral package body made of resin, and including a hollow front half having a cavity for housing the LED chip and a rear half bounding on the front half by the lead frame.
2. The side view LED according to claim 1 , the toothed structure of the lead frame forms a resin flow passage promoting resin to flow from the rear half to the front half of the package body.
3. The side view LED according to claim 2 , wherein the resin flow passage is configured to promote resin flow along a wall of the cavity from both lateral edges of the lead frame to the front half of the package body.
4. The side view LED according to claim 2 , wherein the toothed structure of the lead frame further comprises a groove or hole that is buried in the package body.
5. The side view LED according to claim 2 , wherein the toothed structure of the lead frame is formed by punching.
6. The side view LED according to claim 1 , wherein the toothed structure of the lead frame comprises a groove formed in the lateral edge of the lead frame to expose a bottom of the cavity.
7. The side view LED according to claim 6 , wherein the groove in the lateral edge of the lead frame is formed to such an extent that the bottom of the cavity does not directly contact the LED chip.
8. The side view LED according to claim 6 , wherein the groove in the lateral edge of the lead frame is formed along a major part of the lead frame edge in the cavity to such an extent that a portion of the lead frame edge inserted into a wall of the cavity stably supports the lead frame.
9. The side view LED according to claim 6 , wherein a remaining part of the lead frame in the cavity has a width of at least 80% of the thickness of the lead frame.
10. The side view LED according to claim 1 , wherein the toothed structure of the lead frame comprises a groove or hole that is buried in the package body.
11. The side view LED according to claim 10 , wherein the toothed structure of the lead frame comprises a groove caved into the lateral edge of the lead frame from an inside wall of the cavity.