Image sensor and method for fabricating the same
View Patent ↗The image sensor includes a semiconductor substrate, a first color filter pattern formed over the substrate, the first color filter pattern having an edge portion with a first slope, and a second color filter pattern formed next to the first color filter pattern, the second color filter pattern having an edge portion with a second slope.
1. An image sensor comprising:
a semiconductor substrate;
a first color filter pattern formed on the substrate, the first color filter pattern having an edge portion with a first slope; and
a second color filter pattern formed next to the first color filter pattern, the second color filter pattern having an edge portion with a second slope,
wherein the first color filter pattern is engaged with the second color filter pattern to have a slope interface therewith, and the slope interface has a horizontal slope length less than twice a length of a dead space between microlenses subsequently formed on the first and second color filter patterns respectively.
2. The image sensor as claimed in claim 1 , further comprising microlenses formed directly on the first and second color filter patterns.
3. The image sensor as claimed in claim 1 , further comprising a wedge shaped interface layer between the first and second color filter patterns.
4. The image sensor as claimed in claim 3 , wherein the wedge shaped interface layer is formed of an organic material.
5. The image sensor as claimed in claim 1 , the first and second color filter patterns are formed with photoresist material.