IP Library Granted Patent US 7,405,097
Granted Patent B2
US 7,405,097 · App. 11/319,586 · Granted Jul 29, 2008

CMOS image sensor and method for manufacturing the same

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Quick Facts
Patent No.
US 7,405,097
App. No.
11/319,586
Granted
Jul 29, 2008
Kind
B2
Abstract

A CMOS image sensor and a method for manufacturing the same are disclosed, in which a blue photodiode is imparted with a greater thickness to improve sensitivity of blue light. The blue photodiode of a CMOS image sensor includes a first lightly doped P-type epitaxial layer formed on a heavily doped P-type semiconductor substrate; a gate electrode of a transfer transistor formed on the first epitaxial layer; a first N-type blue photodiode region formed on the first epitaxial layer; and a second N-type blue photodiode region formed on the first epitaxial layer corresponding to the first blue photodiode region.

Claims (15)

1. A method for manufacturing a CMOS image sensor, comprising:

forming a first lightly doped P-type epitaxial layer on a heavily doped P-type semiconductor substrate;

forming a gate electrode on the first epitaxial layer;

forming a first N-type blue photodiode region on the first epitaxial layer;

forming a second N-type epitaxial layer on the first epitaxial layer including the first blue photodiode region; and

forming a second N-type blue photodiode region by patterning the second epitaxial layer to remain only on the first blue photodiode region.

2. The method of claim 1 , wherein the second blue photodiode region is formed to a thickness of 300 Å to 5000 Å.

3. A method for manufacturing a CMOS image sensor, comprising:

forming a first lightly doped P-type epitaxial layer on a heavily doped P-type semiconductor substrate;

forming a gate electrode on the first epitaxial layer;

forming a first N-type blue photodiode region on the first epitaxial layer;

forming a dielectric film on the first epitaxial layer including the first blue photodiode region;

patterning the dielectric film to expose the first blue photodiode region; and

forming a second blue photodiode region by forming a second N-type epitaxial layer on the first epitaxial layer corresponding to the first blue photodiode region.

4. The method of claim 3 , wherein the second blue photodiode region is formed to a thickness of 300 Å to 5000 Å.

Assignments (2)
CHANGE OF NAME Recorded Jun 15, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 018176/0351 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2005
From: HAN, CHANG HUN
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 017387/0728 →