Photodiode of CMOS image sensor and method for manufacturing the same
View Patent ↗A photodiode of a CMOS image sensor and a method for manufacturing the same are provided, in which ions implanted in the vicinity of a device isolation film are prevented from being diffused into a photodiode region to reduce a dark current. The photodiode of a CMOS image sensor includes a heavily doped P-type semiconductor substrate, a lightly doped P-type epitaxial layer formed on the semiconductor substrate, a gate electrode formed on the epitaxial layer, a device isolation film and an N-type photodiode region formed in the epitaxial layer, an insulating film formed on the epitaxial layer to open a portion between the device isolation film and the photodiode region, and a heavily doped P-type diffusion region formed in the epitaxial layer between the device isolation film and the photodiode region.
1. A method for manufacturing a photodiode of a CMOS image sensor comprising:
forming a lightly doped epitaxial layer on a semiconductor substrate;
forming a device isolation film on the semiconductor substrate;
forming a photodiode region on the semiconductor substrate;
forming a first insulating film on the lightly doped epitaxial layer including the photodiode region;
patterning the first insulating film to open a portion of the lightly doped epitaxial layer between the device isolation film and the photodiode region, and to open another portion of the lightly doped epitaxial layer for a gate formation region;
forming a photoresist film on the first insulating film to cover the gate formation region on the lightly doped epitaxial layer;
forming a diffusion region only in the opened portion of the lightly doped epitaxial layer between a sidewall of the device isolation film and a sidewall of the photodiode region using the photoresist film pattern and patterned first insulating film as a mask; and
forming a gate electrode on the lightly doped epitaxial layer and inside the gate formation region.
2. The method of claim 1 , further comprising:
depositing a polysilicon layer on the semiconductor substrate including the first insulating film; and
polishing the polysilicon layer using chemical mechanical polishing.
3. A method for manufacturing a photodiode of a CMOS image sensor comprising:
forming a lightly doped P-type epitaxial layer on a heavily doped P-type semiconductor substrate;
forming a device isolation film and an N-type photodiode region in a surface of the epitaxial layer;
forming a first insulating film on the lightly doped P-type epitaxial layer including the photodiode region;
patterning the first insulating film to open a portion of the lightly doped P-type epitaxial layer between the device isolation film and the photodiode region, and to open another portion of the lightly doped P-type epitaxial layer for a gate formation region;
forming a photoresist film pattern on the first insulating film to cover the gate formation region on the lightly doped P-type epitaxial layer;
forming a heavily doped P-type diffusion region only in the opened portion of the lightly doped P-type epitaxial layer between a sidewall of the device isolation film and a sidewall of the photodiode region by implanting P-type ions into the opened portion of the lightly doped P-type epitaxial layer using the photoresist film pattern and the patterned first insulating film as a mask;
removing the photoresist pattern; and
forming a gate electrode on the lightly doped P-type epitaxial layer and inside the gate formation region.
4. The method of claim 3 , further comprising:
depositing a polysilicon layer on the epitaxial layer including the first insulating film; and
polishing the polysilicon layer using chemical mechanical polishing.